Correction equipment of focusing ring

Abstract

Disclosed is correction equipment of a focusing ring. A correction supporting rod is mounted on a base which is used for bearing the focusing ring, and the correction supporting rod is movably connected to the base through a rotating shaft; a pressure application supporting point is arranged at one end of the correction supporting rod, and a correction judgment component is arranged on one side of the correction supporting rod. The pressure application supporting point of the correction supporting rod supports a to-be-corrected portion of the focusing ring, and then rotates around the rotating shaft to correct the supporting rod, force is applied to the focusing ring to correct the focusing ring, and the deformation portion of the focusing ring returns to the original position. In the correction process, when the focusing ring touches the correction judgment component, which shows that the focusing ring is corrected. On the basis of the lever principle, the correction equipment can easily and rapidly deform the focusing ring, the correction judgment component can effectively judge whether the focusing ring is corrected in place or not, and therefore the focusing ring can be rapidly and efficiently corrected.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a correction device for a focus ring. Background technique [0002] Sputtering is a thin-film deposition technology commonly used in the production process of modern semiconductor chips. It uses high-energy particles to bombard a high-purity target, so that the target atoms escape from the surface and are evenly deposited on the substrate to form a uniform thin film. Layers are used to form various barrier layers, interconnect lines and contact layers of integrated circuits on the substrate. However, during the sputtering process, since the high-energy particles bombard the target from all directions, the target atoms escaping from the target surface will break away from the target surface from all directions, and then reach the wafer surface along a straight line, which cannot guarantee the substrate The uniformity of the thin film layer deposited in each part affects...

AI Technical Summary

Problems solved by technology

[0006] The existing correction process generally uses manpower to bend the port of the focus ring and restore the openings 11 and 12 of the focus ring to their original positions. However, when the focus ring is used, the installation accuracy is high, and it often requires repeated corrections by manpower to return to its original position. Moreover, during repeated corrections, the connection structure between the metal layer attached to the focus ring and the focus ring will be destroyed, resulting in small cracks in the metal layer attached to the focus ring or breakage of part of the attached film (often unrecognizable by the human eye), Therefore, during the secondary use of the focus ring, this part of the metal layer will peel off, or the ions in the sputtering process will hit this part of the metal layer and there will be discharge defects, thereby reducing the quality of the coating film, and even causing the coating process to fail.

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