Correction device for focus ring

Abstract

A correction device for a focus ring, a correction support rod is installed on a base carrying the focus ring, the correction support rod is movably connected to the base through a rotating shaft, and one end of the correction support rod is provided with a pressure fulcrum; A correction judging component is arranged on one side of the correction pole. The pressure fulcrum of the correction rod is against the part of the focus ring to be corrected, and then the correction rod is rotated around the shaft to apply force to the focus ring to correct the focus ring and return the deformed part of the focus ring to its original position . During the correction process, when the focus ring touches the correction judging part, it indicates that the correction of the focus ring is completed. The correction device can easily and quickly cause the focus ring to change based on the principle of leverage, and the correction judging part can effectively judge whether the focus ring is corrected in place, thereby completing the correction of the focus ring quickly and efficiently.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a correction device for a focus ring. Background technique [0002] Sputtering is a thin-film deposition technology commonly used in the production process of modern semiconductor chips. It uses high-energy particles to bombard a high-purity target, so that the target atoms escape from the surface and are evenly deposited on the substrate to form a uniform thin film. Layers are used to form various barrier layers, interconnect lines and contact layers of integrated circuits on the substrate. However, during the sputtering process, since the high-energy particles bombard the target from all directions, the target atoms escaping from the target surface will break away from the target surface from all directions, and then reach the wafer surface along a straight line, which cannot guarantee the substrate The uniformity of the thin film layer deposited in each part affects...

AI Technical Summary

Problems solved by technology

[0006] The existing correction process generally uses manpower to bend the port of the focus ring and restore the openings 11 and 12 of the focus ring to their original positions. However, when the focus ring is used, the installation accuracy is high, and it often requires repeated corrections by manpower to return to its original position. Moreover, during repeated corrections, the connection structure between the metal layer attached to the focus ring and the focus ring will be destroyed, resulting in small cracks in the metal layer attached to the focus ring or breakage of part of the attached film (often unrecognizable by the human eye), Therefore, during the secondary use of the focus ring, this part of the metal layer will peel off, or the ions in the sputtering process will hit this part of the metal layer and there will be discharge defects, thereby reducing the quality of the coating film, and even causing the coating process to fail.

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