Adjustable roll-to-roll chemical nickel-plating device

Abstract

The invention discloses an adjustable roll-to-roll chemical nickel-plating device, which belongs to the field of FPC production. The adjustable roll-to-roll chemical nickel-plating device is composed of a hydraulic expansion device, an import roller, a bracket, a guide roller fixed plate, a guide roller, an export roller and a plating tank. The adjustable roll-to-roll chemical nickel-plating device is characterized in that the hydraulic expansion device is connected with the bracket, the guide roller fixed plate is provided with a threaded hole, the guide roller is fixed on the guide roller fixed plate by the threaded hole, the guide roller fixed plate is connected below the bracket, the import roller and the export roller are respectively arranged on the two sides of the bracket, and the plating tank is located below the guide roller fixed plate. The adjustable roll-to-roll chemical nickel-plating device is mainly designed for solving the problems of inflexible equipment, inapplicability to various plating solution systems, and cleaning difficulty existing in a roll-to-roll production mode. According to the invention, a situation that a roll-to-roll apparatus is effectively applied to the preparation of embedded resistance materials can be ensured, thereby achieving efficient continuous production and greatly reducing the production cost.

Description

technical field [0001] The invention relates to an adjustable roll-to-roll electroless nickel plating device, in particular to an electroless nickel plating device suitable for producing embedded resistance materials in FPC roll-to-roll production. Background technique [0002] With the development of electronic products towards miniaturization and multi-function, the manufacture of embedded passive components has become one of the important development directions of the FPC industry. Resistance occupies a large proportion in the use of passive components, so the preparation of embedded resistance materials is of great significance. The current preparation methods mainly include electroplating, sputtering, and chemical plating. Electroless plating is a new method with low energy consumption and good plating effect, which is in line with the development trend of PCB, but its application is still in its infancy. Embedded resistance materials prepared by electroless plating a...

AI Technical Summary

Problems solved by technology

[0003] In the sheet plating method, it is necessary to use fixtures or baskets to fix the plating sheet, then immerse it in the plating solution, and finally take it out and stack it, which is inefficient

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