Sorting method for chips with inappropriate yield to technological level

A classification method and chip technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as misjudgment, little effect, low yield rate, etc., and achieve the effect of improving efficiency and avoiding waste of manpower and material resources

Active Publication Date: 2015-07-01
SEMICON MFG INT (SHANGHAI) CORP
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on the above defects, when classifying chips with a yield rate that is not commensurate with the technological level, misjudgment is likely to occur, and the low yield rate caused by, for example, defects in

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sorting method for chips with inappropriate yield to technological level
  • Sorting method for chips with inappropriate yield to technological level
  • Sorting method for chips with inappropriate yield to technological level

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] As mentioned in the background technology, in the prior art, when classifying chips with a yield rate that is not commensurate with the technological level, misjudgment is likely to occur, and the yield rate is too low due to, for example, defects in the product itself, insufficient design, etc. Classified as a special and systematic problem, this will cause the manufacturer to spend a lot of manpower and material resources to improve the yield of the product with little effect. In view of the above problems, the present invention proposes based on the individualized product itself, and according to the test results of each test item in the chip electrical test, a correlation analysis is carried out between the test item and the process parameters used for making the chip. If it is not relevant, it is judged that the low yield rate of the chip is not a special and systematic problem; in addition, in order to avoid the large amount of calculation in the correlation analys...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a sorting method for chips with inappropriate yield to technological level. The method analyzes correlation to the test item and technology parameter for manufacturing chips based on personalized product according to the test result of each test item in the chip electrical performance test, if the test item is uncorrelated to the technology parameter, judging that the yield which is inappropriate to the technological level of the chip does not belong to the specific and specific problem; in addition, in order to avoid large amounts of computation and improve the efficiency, only analyzing the correlation for the test item with lowest yield in the related group and technology parameter rather than analyzing the correlation for each test item; the sorting method can accurately judge that the cause reason for the inappropriate chip yield to the technological level is the specific and specific problem and the waste of manpower and material resources can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for classifying chips with a yield rate not commensurate with the technological level. Background technique [0002] In the field of semiconductor manufacturing, yield rate is very important for mass-produced products (including at least one chip). Among them, the yield rate is mainly divided into two types: one is the yield rate commensurate with the process level, and the other is the yield rate not commensurate with the process level. If there is a yield rate that is not commensurate with the process level, the manufacturer will consider whether the low yield rate is a special and systematic problem, and if so, will invest a lot of manpower and material resources to improve the yield rate of the product. If not, the overall yield rate of the product will be improved in accordance with the similar methods of other products on the production line. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67
CPCH01L21/67242
Inventor 赵永林
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap