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Copper foil press fit stripping mechanism with release paper

A stripping mechanism and take-off technology, applied in lamination, lamination device, lamination auxiliary operation, etc., can solve the problems of slow efficiency and high cost, achieve labor saving, expand sharing, save manufacturing costs and management costs Effect

Active Publication Date: 2015-07-08
BOZHON PRECISION IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a copper foil pressing and peeling mechanism with release paper for the deficiencies of the prior art, which solves the slow efficiency and high cost caused by manual pressing and peeling in the market. Save time, labor and labor, improve production efficiency; greatly save manufacturing costs and management costs

Method used

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  • Copper foil press fit stripping mechanism with release paper
  • Copper foil press fit stripping mechanism with release paper

Examples

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Embodiment Construction

[0022] Examples, see attached figure 1 and 2 , a copper foil pressing and peeling mechanism with a release paper, which includes a base plate 1, a carrier 2 is installed on the base plate, a PCB board is placed in the carrier, and a copper foil with a release paper is placed on the PCB board; The lifting cylinder fixed plate 4 is installed on the said base plate through the pillar 3, and the lifting cylinder 5 is installed on the top of the lifting cylinder fixed plate; There are four pillars, the lower ends of the four pillars are fixed on the base plate, the upper ends are fixed on the cylinder mounting plate, and the four pillars pass through the lifting plate respectively, and four guide sleeves 8 are installed on the lifting plate. The pillars pass through the corresponding guide sleeves respectively. The guide pillars and the guide sleeves have a guiding effect. When the lifting cylinder drives the lifting plate to move up and down, the lifting plate can move up and dow...

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PUM

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Abstract

The invention relates to a copper foil press fit stripping mechanism with release paper. A carrier is arranged on a bottom plate and a PCB is arranged in the carrier; a copper foil with the release paper is arranged on the PCB; the bottom plate is provided with a hoisting air cylinder fixing plate through a support and is provided with a hoisting air cylinder; the lower end of the hoisting air cylinder is connected with a lower pressing plate by a hoisting plate; and a waste material box is arranged at the lower side behind the bottom plate. When the copper foil press fit stripping mechanism works, the hoisting air cylinder is pressed down and keeps the pressure; after the copper foil is pressed, the hoisting air cylinder is reset; a rodless air cylinder a of a double-air-cylinder displacement mechanism drives lower and upper movable plates to move; after a rodless air cylinder b drives a connection plate to be moved in place, a rotary air cylinder of an overturning adsorption mechanism starts to rotate for 90 degrees to keep parallel with the PCB; then a lower pressing air cylinder of the double-air-cylinder displacement mechanism starts to press and a vacuum suction nozzle starts to work; the lower pressing air cylinder is reset after the release paper is adsorbed; and the rotary air cylinder rotates and the double-air-cylinder displacement mechanism is reset, a vacuum suction mechanism stops working after the double-air-cylinder displacement mechanism is reset, and the release paper is put into the waste material box. The copper foil press fit stripping mechanism has the advantages that the time and the labor are saved and the efficiency is improved.

Description

Technical field: [0001] The invention relates to the field of pressing and peeling mechanism equipment, in particular to a mechanism for automatically peeling off the release paper after laminating the shielding signal copper foil of a PCB board. Background technique: [0002] There are various styles of PCB boards on the market. The copper foil with release paper needs to be laminated on the PCB board. After lamination, the release paper needs to be peeled off and sent to the waste box. The existing technology is generally manual lamination and peeling. , its manual operation is slow in efficiency and high in cost; moreover, it needs to constantly replace the carrier to adapt to different styles of PCB boards, which will bring a lot of trouble in operation and greatly waste the manufacturing cost and management cost. Invention content: [0003] The purpose of the present invention is to provide a copper foil pressing and peeling mechanism with release paper for the defici...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B38/10B32B37/10
Inventor 吕绍林杨愉强王建福刘陈亮
Owner BOZHON PRECISION IND TECH CO LTD
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