Heater with inserted pin type cooling device
A radiator and heater technology, applied in ohmic resistance heating, ohmic resistance heating parts, electric heating devices, etc., can solve the problems of the heater being prone to safety hazards, the complex structure of the radiator of the heater, and the impact of long-term use. , to achieve the effect of facilitating the conduction and circulation of heat, facilitating cleaning, and increasing the effective heat dissipation area
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specific Embodiment approach 1
[0011] Specific implementation mode one: the following combination figure 1 , figure 2 , image 3 with Figure 5 This embodiment is described. The heater with a pin-type radiator described in this embodiment includes a heat dissipation substrate 1, an upper thermally conductive insulating partition 2, an electric heating plate 3, a lower thermally conductive insulating partition 4, a base 5 and multiple A heat dissipation warp 6, the middle part of the base 5 is provided with a groove, the lower heat conduction insulation partition 4, the electric heating plate 3 and the upper heat conduction insulation partition 2 are embedded in the groove of the base 5 sequentially from bottom to top, the base 5 and The left and right sides of the heat dissipation substrate 1 are provided with angular grooves, the angular grooves of the heat dissipation substrate 1 are slidably inserted into the angular grooves of the base 5, the heat dissipation fins 6 are hollow pins, and a plurality o...
specific Embodiment approach 2
[0012] Specific implementation mode two: the following combination figure 1 This embodiment will be described. This embodiment will further describe Embodiment 1. The groove depth of the base 5 is 3mm, and the overall thickness of the lower heat-conducting and insulating partition plate 4, the electric heating plate 3, and the upper heat-conducting and insulating partition plate 2 is the same as the concave depth of the base 5. Groove depth is the same.
specific Embodiment approach 3
[0013] Specific implementation mode three: the following combination figure 2 with Figure 4 Describe this embodiment, this embodiment will further explain Embodiment 1, the longitudinal depth of the angular groove of the heat dissipation substrate 1 is a, and 2mm≤a≤3mm, the transverse length of the angular groove is b, and 1.5mm≤b≤ 2mm.
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Abstract
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