Prediction method of thermal fatigue life of BGA solder joints considering the influence of temperature cycle load sequence loading

Abstract

The invention discloses a method for predicting the thermal fatigue life of BGA solder joints considering the influence of sequential loading of temperature cycle loads, including 1. analyzing the influence and reason of sequential loading of temperature cycle loads on the thermal fatigue life of BGA solder joints; 2. according to the temperature cycle loads The influence of sequential loading on the thermal fatigue life of BGA solder joints and referring to the Paris formula to improve the Darveaux model, constructing a BGA solder joint thermal fatigue life prediction model considering the influence of sequential loading of temperature cycle loads; 3. Determine the influence of sequential loading of temperature cycle loads The fitting and determination method of each parameter in the thermal fatigue life prediction model of BGA solder joints; 4. The analysis and verification of the thermal fatigue life prediction model of BGA solder joints considering the influence of temperature cycle load sequence loading, and the Darveaux model under single temperature cycle load respectively The comparative analysis of the fatigue life prediction results, and the comparative analysis of the fatigue life prediction results of the Miner theory under the sequential loading of temperature cycles; 5. Complete the construction of the prediction method.

Description

technical field [0001] The invention relates to a method for predicting the thermal fatigue life of BGA solder joints considering the impact of sequential loading of different temperature cycle loads, and belongs to the technical field of failure physics. Background technique [0002] With the continuous development of electronic packaging technology, the field of application of electronic products is becoming more and more extensive, and the environmental conditions encountered in the use of electronic products are becoming more and more complex and harsh. There may be sudden changes in the environment, changes in working modes, etc., so that electronic products are loaded in sequence. under load conditions. BGA solder joints (ball grid array package solder joints) are a key link to ensure the reliability of electronic products, and the prediction and evaluation of their fatigue life is of great significance to products. However, for the most important thermal fatigue in s...

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Problems solved by technology

However, for the most important thermal fatigue in solder joint fatigue, the existing life prediction model under the condition of temperature cycle cannot consider the influence of load sequence when the loading conditions change, and the application of Miner theory to linear accumulation results will have large errors, and the corresponding The research work is very limited, and there is no mature method for easy application

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