circuit board assembly

Abstract

The invention discloses a circuit board assembly comprising a first circuit board, a second circuit board and a buckling member. The second circuit board and the first circuit board are arranged in a superposition way. The first circuit board is provided with a first clamping groove. The second circuit board is provided with a second clamping groove. The buckling member comprises an opening. The first circuit board and the second circuit board are superposed and then inserted in the opening so that the buckling member is enabled to be clamped in the first clamping groove and the second clamping groove. According to the circuit board assembly, the first circuit board and the second circuit board are arranged in the superposition way, the first circuit board and the second circuit board are respectively provided with the first clamping groove and the second clamping groove and the buckling member and the first clamping groove and the second clamping groove are clamped so that an objective of fixing the two circuit boards is realized. The buckling member and the first clamping groove and the second clamping groove are connected in a buckling way so that subsequent assembling or disassembling is facilitated, and damage to the circuit board in the assembling or disassembling process can be reduced. Meanwhile, buckling connection is adopted so that assembling efficiency is high and thus production efficiency can be enhanced.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a circuit board assembly. Background technique [0002] As a provider of circuit connections for electronic components, a circuit board is a support for electronic components and is used in various intelligent terminal equipment. [0003] Although most circuit boards are mostly used to connect with other electronic components, sometimes two or more circuit boards need to be connected to each other to realize certain connection functions. Most of the current methods are: the two circuit boards are bonded together by a fixing tape to achieve the purpose of fixing the two circuit boards. However, the above method has the following disadvantages: [0004] 1. The method of adhesive tape bonding takes a long time, so the production efficiency is low, resulting in high production costs; [0005] 2. Due to the adhesive tape bonding method, when the two circuit boards need to ...

AI Technical Summary

Problems solved by technology

[0004] 1. The method of adhesive tape bonding takes a long time, so the production efficiency is low, resulting in high production costs;

[0005] 2. Due to the adhesive tape bonding method, when the two circuit boards need to be disassembled, it is not easy to disassemble, and the pins on the circuit board are easily damaged, which is not conducive to the repeated use of the circuit board;

[0006] 3. In the process of assembling the circuit board with other components, due to the stickiness of the tape, it is easy to tear off the two circuit boards due to the stickiness of the tape, resulting in broken wires or pin damage.

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