Teflon-based nano stannic oxide-doped heat radiation material used for LED light source and preparation method thereof

Abstract

The invention relates to a LED heat radiation material, and more specifically relates to a teflon-based nano stannic oxide-doped heat radiation material used for LED light source and a preparation method thereof. The material comprises the following raw materials by weight part: 4-6 parts of boron oxide micro powder with 200-300 meshes, 2-3 parts of nano stannic oxide, 4-6 parts of yttrium sol with solid content being 10-15%, 1-3 parts of liquid calcium-zinc stabilizer, 3-5 parts of potassium metasilicate, 1-2 parts of potassium pyrophosphate, 1-2 parts of bubble-free surfactant at normal temperature. 30-40 parts of water, 20-25 parts of aluminium nitride micro powder with 400-600 meshes, 40-50 parts of teflon micro powder with 200-300 meshes, and 2-3 parts of auxiliary agent. The heat radiation material has the advantages of high efficiency and uniform / stable thermal conductivity, has characteristics of environment resistant and corrosion resistant performance, good stability of thermal dimension, clean and dirt-resistant surface, easy processing and cutting, environmental protection and high efficiency.

Description

technical field [0001] The invention relates to an LED heat dissipation material, in particular to a polytetrafluoroethylene base-doped nano tin dioxide heat dissipation material for an LED light source and a preparation method thereof. Background technique [0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compoun...