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A kind of integrated circuit structure and its manufacturing method

A technology of integrated circuits and manufacturing methods, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as short circuits between metal fuses and substrates

Active Publication Date: 2018-02-13
FOUNDER MICROELECTRONICS INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides an integrated circuit structure and its manufacturing method, which are used to solve the problem of short circuit between the metal fuse and the substrate during the process of blowing the metal fuse

Method used

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  • A kind of integrated circuit structure and its manufacturing method
  • A kind of integrated circuit structure and its manufacturing method
  • A kind of integrated circuit structure and its manufacturing method

Examples

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Embodiment Construction

[0033] An embodiment of the present invention provides an integrated circuit structure, which is used to solve the problem in the prior art that a short circuit occurs between a metal fuse and a substrate when the metal fuse is blown during the trimming of the integrated circuit.

[0034] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The following drawings are only an example, and do not specifically limit the structure and shape.

[0035] An embodiment of the present invention provides an integrated circuit structure, such as image 3 shown and Figure 4 As shown, the integrated circuit structure includes:

[0036] A substrate 101 , an insulating protection layer 102 , a dielectric layer 103 , a metal fuse 104 and an isolation metal part 105 .

[0037] The metal fuse 104 is insulated from both the substrate 101 and the insulating protection layer 102 .

[0038] The isolated metal part 105 is disposed be...

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Abstract

The invention discloses an integrated circuit structure and a making method thereof, so the short circuit problem between a metal fuse and a substrate can be solved in a metal fusion process; the integrated circuit structure comprises the substrate, an insulation protection layer, the metal fuse and an isolation metal part; the metal fuse, the substrate and the insulation protection layer are all insulated; the isolation metal part is arranged between the metal fuse and the substrate, and insulated from the metal fuse and the substrate; the metal fuse is exposed in a room formed by etching a preset zone of the insulation protection layer; the size of the preset zone is smaller than or equal to the size of one surface, opposite to the insulation protection layer, of the isolation metal part.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an integrated circuit structure and a manufacturing method thereof. Background technique [0002] In an integrated circuit, usually several metal fuses are provided, and the metal fuse is a metal resistor located in the integrated circuit. By adopting a specific method, the metal fuse can be fused, that is, to achieve the purpose of breaking the circuit, and when the metal fuse is not fused, it is turned on, that is, by not blowing or blowing the metal fuse, the adjustment and integration can be achieved. The purpose of the function or parameters of the circuit, this adjustment process is called "trimming". [0003] Such as figure 1 and figure 2 shown (the figure 1 Shown is a schematic diagram of the planar structure of the integrated circuit structure, figure 2 shown as figure 1 The schematic diagram of the plane structure shown is the structure of the sectional view a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/525H01L21/768
Inventor 潘光燃文燕石金成高振杰王焜
Owner FOUNDER MICROELECTRONICS INT