Composite scab structure and producing method thereof

Abstract

The compound cam structure is composed of a base plate, a contacting pad located on the base plate, a main body comprised of the polymer on the contacting pad, a conducting socket in the main body, which interpenetrates the main body. The conducting layer connects with the conducting pad via the conducting socket and the protecting layer on the base plate covers part of the contacting pad.

Description

technical field [0001] The invention relates to a construction technology of an integrated circuit, in particular to a compound bump structure and a manufacturing method applied in the construction technology between an integrated circuit and a display. Background technique [0002] In some existing electronic devices, the connection between the components and the main circuit is performed through a conductive film (such as anisotropic conductive adhesive, or ACF for short). Anisotropic conductive adhesive ACF is made by mixing non-conductive synthetic resin and conductive particles. Conductive particles 1 such as Figure 1A As shown in the cross-sectional view of , its diameter is about 3-5 μm, its central part 1a is made of polymer, and the outside is covered with metal conductor 1b, such as gold, nickel, tin, etc. [0003] ACF is often used in the manufacture of liquid crystal displays, and some are used to directly package the driver chip of the panel on the glass substr...

AI Technical Summary

Problems solved by technology

And because the elastic recovery force of the polymer of its compound bump structure is larger than that of the gold bump in the prior art, it can buffer the stress generated by the bonding between the semiconductor substrate and the glass substrate, and solve the problem of deformation

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