Electroplating method and device of circuit boards

An electroplating device and circuit board technology, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of reduced production capacity, low efficiency, material waste, etc., and achieve the effect of improving production utilization rate and avoiding material waste.

Active Publication Date: 2015-08-26
GCI SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the dummy board needs to be specially made for circuit boards with different material numbers, resulting in waste of materials and reduced production capacity. At the same time, for the production of small batches of circuit boards, the efficiency is low

Method used

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  • Electroplating method and device of circuit boards
  • Electroplating method and device of circuit boards
  • Electroplating method and device of circuit boards

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Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0049] see figure 2 , is a schematic flow chart of an embodiment of an electroplating method for a circuit board provided by the present invention, including:

[0050] S1. Using the chain-type continuous forward method, multiple circuit boards are sequentially transported into the plating tank;

[0051] S2. Detect each circuit board entering the entrance of the plating tank;

[0052] S3. When it is detected that the full tank current of the current entering circ...

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PUM

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Abstract

The invention discloses an electroplating method of circuit boards, which comprises the steps of conveying a plurality of circuit boards into a plating tank in sequence in a chain continuous forward manner, detecting each circuit board entering an inlet of the plating tank, starting timing when detecting that full cylinder current of the current circuit board is different from that of the previous circuit board, adjusting working current of the plating tank according to the duration, the full cylinder current of the current circuit board and the full cylinder current of the previous circuit board, and electroplating the circuit boards in the plating tank according to the adjusted working current, wherein the full cylinder current refers to the working current when the circuit boards accommodated in the plating tank have the same electroplating parameter. Correspondingly, the invention further discloses an electroplating device of the circuit boards. With the adoption of the method and the device, seamless switchover of electroplating of different circuit boards can be achieved, and the production and utilization rate of the circuit boards is increased.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an electroplating method and device for circuit boards. Background technique [0002] Continuous electroplating is an electroplating method in which the chain continuously conveys the circuit board forward to the plating tank for electroplating. Due to the different electroplating areas of circuit boards with different material numbers, the plating tank needs to use different working currents to electroplate circuit boards with different material numbers. In the prior art, for the continuous electroplating of circuit boards with different material numbers, it is generally used to add a dummy plate between two different material number circuit boards to realize the switching of the working current in the plating tank, wherein the length of the dummy plate and the length of the plating tank of the same length. [0003] Such as figure 1 As shown, the circuit board of mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12C25D7/00
Inventor 詹世敬唐政和彭胜峰彭承刚
Owner GCI SCI & TECH
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