Speaker module

A loudspeaker module and loudspeaker technology, applied in the direction of loudspeaker transducer fixation, sensor, transducer diaphragm, etc., can solve the problems of increasing the space occupied by micro-speakers, failing to meet heat dissipation requirements, increasing volume, etc., to achieve Effect of improving heat dissipation performance and preventing impact

Inactive Publication Date: 2015-09-09
GOERTEK INC
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AI Technical Summary

Problems solved by technology

However, for micro-speakers used in communication terminals such as mobile phones, the casing with too much metal will affect the performance of the antenna near the speaker and hinder the normal operation of related parts such as the antenna.
On the other hand, due to the size limitation of the micro-speaker module, the size of the heat sink cannot be too large, so the ideal heat dissipation requirements are often not met.
However, setting the heat sink will inevitably increase the number of components inside the speaker and increase the space that the micro-speaker needs to occupy.
Therefore, setting a heat sink in a micro-speaker cannot effectively solve the heat dissipation problem, but increases the volume

Method used

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Embodiment Construction

[0022] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0023] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0024] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0025] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a speaker module, which comprises a speaker component (3), a module shell and a front cover (4). The module shell is used for bearing the speaker component (3) and comprises a first shell (11) and a second shell (12), and a heat conducting filler (2) is filled in the first shell (11). The front cover is matched with the module shell to package the speaker component (3). According to the speaker module provided by the invention, the heat which is generated during working of the speaker component (3) can be quickly discharged through the module shell, so that overheating of the speaker component (3) is prevented, and thus the performance loss of the speaker due to high temperature is avoided.

Description

technical field [0001] The invention relates to a loudspeaker module, in particular to a miniature loudspeaker module with good heat dissipation effect. Background technique [0002] Micro-speaker modules are very common electronic components in electronic products such as mobile phones and mobile computers. They provide people with many conveniences such as communication and entertainment in their lives. At present, the development trend of devices such as mobile phones is thinner, smaller, and more powerful. Correspondingly, the volume of each component in the mobile phone also needs to be further miniaturized. [0003] In a mobile phone, a micro-speaker module occupies a relatively large space. How to reduce the volume of the micro-speaker module is a key issue for further thinning and shrinking the mobile phone. How to reduce the space occupied by micro-speakers has become the main research and development direction for those skilled in the art. At this stage, the main...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/02
CPCH04R9/022B29C45/0013B29K2105/16B29K2995/0013B29L2031/3418H04R31/006H04R1/025H04R7/127H04R7/18H04R9/025H04R9/06
Inventor 邵明辉杨健斌
Owner GOERTEK INC
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