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Printed circuit board

A technology for printed circuit boards and soldering pads, which is applied to printed circuit components, electrical connection printed components, etc. It can solve problems such as empty soldering and short circuit, prolong the time of soldering, reduce soldering, and enhance the ability of soldering Effect

Inactive Publication Date: 2015-09-16
GUOYU ELECTRONICS BEIHAI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the printed circuit board welding process, the printed circuit board can be automatically welded to the surface mount device (SMD) on the board through special welding equipment. However, for some surface mount devices due to the gap between adjacent pins If the spacing is too small, it is prone to defects such as empty welding and short circuit in the welding process.

Method used

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Examples

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Embodiment Construction

[0025] figure 1 It is a perspective view of the printed circuit board 100 in an embodiment of the present invention. In this embodiment, the printed circuit board 100 is conveyed along the direction indicated by the arrow X during soldering, and a plurality of pad groups 1, 2, 3 are provided on the soldering surface 100a of the printed circuit board 100, and a plurality of solder pad groups Disk groups 1, 2, and 3 are used for soldering multiple surface mount devices SMD1, SMD2, and SMD3. In this embodiment, the surface mount devices SMD1, SMD2, SMD3 are rectangular in shape, and each surface mount device SMD1, SMD2, SMD3 has a group of protruding pins 10a, 10b, 10c (in this embodiment, only three are used as an example, but not limited to three, may include less than or more than three pins), so each pad group 1, 2, 3 contains There are 6 pads. The three pins 10a, 10b, 10c are all soldered to the soldering surface 100a of the printed circuit board 100 through corresponding...

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Abstract

A printed circuit board comprises a welding surface, wherein welding pad groups used for welding pins of surface-mounted devices are arranged on the welding surface, an outer side welding pad of each welding pad group is additionally provided with a protruding part, and each protruding part faces towards a direction opposite to the transmission direction of the printed circuit board in welding. According to the printed circuit board, the outer side welding pad of each welding pad group is additionally provided with the protruding part, the tin supporting ability of the welding pad groups is improved, the tinning time of the surface-mounted devices is prolonged, and the undesirable phenomena such as insufficient welding and short circuit occurred in the welding process of the printed circuit board can be effectively reduced.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with dummy pads. Background technique [0002] In the printed circuit board welding process, the printed circuit board can be automatically welded to the surface mount device (SMD) on the board through special welding equipment. However, for some surface mount devices due to the gap between adjacent pins If the spacing is too small, it is more prone to defects such as empty welding and short circuit in the welding process. Therefore, how to design a printed circuit board to overcome the above-mentioned problems is a big challenge, and it has also become an urgent need for improvement in the current industry. Contents of the invention [0003] In view of this, it is necessary to provide a printed circuit board, which can reduce defects such as false soldering and short circuit in the soldering process of the printed circuit board. [0004] One embodiment of th...

Claims

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Application Information

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IPC IPC(8): H05K1/11
Inventor 贾幼萍朱辉
Owner GUOYU ELECTRONICS BEIHAI