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Chip Electronic Component And Manufacturing Method Thereof

A technology of electronic components and manufacturing methods, which is applied in the manufacture of inductors/transformers/magnets, electrical components, parts of transformers/inductors, etc., and can solve problems such as the short-circuit aspect ratio of the coil part and the increase in the distance between the coil parts

Active Publication Date: 2015-09-23
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, since the plating resist needs to have a predetermined width or more in order to maintain the form of the plating resist, the spacing between the coil parts increases.
[0011] In addition, when the electroplating method is performed according to the prior art, due to the isotropic growth phenomenon in which the coil grows not only in its width direction but also in its thickness direction, a short circuit occurs between coil parts and a high aspect ratio ( AR) will have limitations

Method used

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  • Chip Electronic Component And Manufacturing Method Thereof
  • Chip Electronic Component And Manufacturing Method Thereof
  • Chip Electronic Component And Manufacturing Method Thereof

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Embodiment Construction

[0038] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0039] This disclosure, however, may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0040] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0041] chip electronic components

[0042] Hereinafter, a chip type electronic component according to an exemplary embodiment of the present disclosure will be described. Specifically, a thin inductor will be described, but the present disclosure is not limited thereto.

[0043] figure 1 is a schematic perspective view showi...

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PUM

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Abstract

There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0031377 filed with the Korean Intellectual Property Office on March 18, 2014, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip electronic component and a manufacturing method thereof. Background technique [0003] Inductors, which are one of chip electronic components, are typical passive components that form electronic circuits together with resistors and capacitors to remove noise. Such an inductor may be combined with a capacitor using electromagnetic properties to constitute a resonance circuit, a filter circuit, etc. that amplify a signal of a specific frequency band. [0004] Recently, with the increasing trend of miniaturization and thinning of information technology (IT) such as various communication devices, display devices, etc., various elements such as inductors, capacitors, transistors, etc. Research o...

Claims

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Application Information

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IPC IPC(8): H01F17/04H01F27/28
CPCC25D7/001H01F27/2804H01F2027/2809H01F27/29H01F17/0013H01F17/04H01F27/292H01F41/046C25D5/02C25D5/10
Inventor 车慧娫李东焕郑汀爀尹灿房惠民金珆暎
Owner SAMSUNG ELECTRO MECHANICS CO LTD