Laser processing device and process for laser hot melt adhesive quick adhesion thereof

A technology of laser processing and hot-melt adhesive, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of backward laser processing head device and processing technology, and achieve the effect of ensuring production quality and improving product efficiency

Inactive Publication Date: 2015-09-30
KELUODE LASER EQUIP SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing laser processing head device and processing technology are backward and need to be improved

Method used

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  • Laser processing device and process for laser hot melt adhesive quick adhesion thereof
  • Laser processing device and process for laser hot melt adhesive quick adhesion thereof
  • Laser processing device and process for laser hot melt adhesive quick adhesion thereof

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Embodiment Construction

[0031] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and...

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Abstract

The invention discloses a laser processing device and a process for laser hot melt adhesive quick adhesion thereof. The laser processing device can perform temperature monitoring and comprises a laser processing device body, a laser head arranged on the body, a temperature measuring head and a fixed / adjustable support, wherein the temperature measuring head can move in a front-rear mode through the adjustment of a thread for clamping the temperature measuring head, an adjusting shaft can be driven to rotate through the adjustment of a knob on the right side, and the temperature measuring head rotates around a fixed button. A laser transmitting device is positioned on the side of the laser head to be used for laser injection from the side of the laser head, a guiding light generation device is positioned over the laser head, and guiding light is injected above the laser head and is collected to the surface of a processed object through a lens. According to the scheme, the problem of a laser processing head and a temperature measuring probe is solved, and an internally matched mechanical part can adjust the position of a temperature measurement point so that the temperature measurement point coincides with a laser processing point. The spatial accuracy of the temperature measuring probe is smaller than 1 mm, the temperature changes of the position of the laser processing point can be measured accurately, and the processing effect is fed back.

Description

technical field [0001] The invention relates to a laser processing device and a laser hot-melt adhesive fast bonding process thereof. Background technique [0002] In the existing processing technology, the foam substrate is thicker and the material is softer, so it is difficult to press-cut the tape to a width of less than 1mm, and it is difficult to cope with fine paste. Residual foam material or sticky layer during rework is difficult to completely remove and difficult to rework. Not waterproof. [0003] The existing laser processing head device and processing technology are backward and need to be improved. Contents of the invention [0004] The purpose of the present invention is to solve the above problems and provide a laser processing device capable of temperature monitoring, which integrates a laser processing head and a temperature measuring probe, and is equipped with mechanical parts inside to adjust the position of the temperature measuring point so that it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/70
CPCB23K26/00
Inventor 黄再福
Owner KELUODE LASER EQUIP SHENZHEN
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