Solder paste printing assembly for frame
A solder paste printing and frame technology, applied in printing, printing machine, rotary printing machine and other directions, can solve the problems of poor consistency of solder paste, low production efficiency, inconvenient operation, etc., to ensure uniformity and consistency, improve Filling efficiency, reliable positioning effect
Active Publication Date: 2015-10-07
YANGZHOU YANGJIE ELECTRONIC TECH CO LTD
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Problems solved by technology
[0003] 1) The method of dispensing solder paste with a needle is used for production. This method can ensure the consistency of the solder paste, but the production efficiency is extremely low, and the solder paste in the needle tube is more expensive than the solder paste in the can;
[0004] 2) Use the method of sticking solder paste in canned solder paste. This method has higher filling efficiency of solder paste, but the consistency of the amount of solder paste is poor, and the needle sticking solder paste is easy to damage
[0005] Moreover, when there is a height difference facing the frame, the solder paste filling is more complicated, the efficiency is low, and it is not easy to operate
Method used
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[0040] The present invention as Figure 1-18 As shown, it includes a frame 1 and a printed board 2. There is a rectangular hole 10 in the middle of the frame 1. A number of horizontal support plates-31 are evenly distributed on one side of the rectangular hole 10. Solder paste is provided on the support plate-31. Slot one 310, one side of the printed board 2 is provided with a number of solder paste holes one-to-one corresponding to the solder paste tank one 310; the support plate one is on the same plane as the top surface of the frame, during work, the solder paste Groove 1 is directly connected to solder paste hole 1;
[0041] The other side of the rectangular hole 10 is uniformly provided with a plurality of solder paste slots 320, and the other side of the printed board 2 is uniformly provided with solder paste holes 22 corresponding to the solder paste slots 320 one by one. The other side of the rectangular hole is correspondingly connected with the other side of th...
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The invention discloses a solder paste printing assembly for a frame. The solder paste printing assembly for the frame is simple in structure and capable of improving work efficiency and guaranteeing evenness and consistency of the solder paste amount. The solder paste printing assembly comprises the frame and a printing plate. A rectangular hole is formed in the middle of the frame, a plurality of first horizontal supporting plates are evenly distributed on one side of the rectangular hole, and the first supporting plates are provided with first solder paste grooves. A plurality of first solder paste holes which are in one-to-one correspondence with the first solder paste grooves are formed in one side of the printing plate. A plurality of second solder paste grooves are evenly distributed in the other side of the rectangular hole, second solder paste holes which are in one-to-one correspondence with the second solder paste grooves are evenly distributed in the other side of the printing plate, and the other side of the rectangular hole is correspondingly connected with the other side of the printing plate through a segment difference structure. According to the solder paste printing assembly for the frame, the filling efficiency of solder paste is improved, the solder paste can be printed at a time, positioning is more accurate, and meanwhile the evenness and consistency of the solder paste are guaranteed.
Description
technical field [0001] The invention relates to the field of diodes or rectifier bridges, and in particular to solder paste printing components of frames. Background technique [0002] In the manufacturing process of diode surface mount series or rectifier bridge series products, one of the processes is solder paste filling of the frame. At present, the solder paste filling methods of most companies are as follows: [0003] 1) Production is done by dispensing solder paste with a needle tube. This method can ensure the consistency of the solder paste, but the production efficiency is extremely low, and the solder paste in the needle tube is more expensive than the solder paste in the can; [0004] 2) The method of sticking solder paste in cans is adopted. This method has higher filling efficiency of solder paste, but the consistency of the amount of solder paste is poor, and the needle sticking solder paste is easy to be damaged. [0005] Moreover, when there is a height di...
Claims
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IPC IPC(8): B41F15/36
Inventor 范永胜王双王毅
Owner YANGZHOU YANGJIE ELECTRONIC TECH CO LTD