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Photovoltaic component packaging glue film resistant to potential induced attenuation

A photovoltaic module encapsulation and adhesive film technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of component corrosion, energy waste, power attenuation, etc., achieve reduced conductivity and good processing performance , good compatibility effect

Inactive Publication Date: 2015-10-07
WENZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

PID leads to the corrosion of components, and in severe cases, it can cause the power of a component to attenuate by more than 50%, resulting in a serious waste of energy, and it has also become the main reason for domestic photovoltaic modules to encounter complaints

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 100 parts of EVA, 1 part of benzoyl peroxide, 0.1 part of 2,6-di-tert-butyl-4-methylphenol, 0.1 part of vinyltriethoxysilane, 0.5 part of bis-2,2 sebacic acid, 6,6-Tetramethylpiperidinol ester, put into the mixing equipment and mix for 30 minutes, then add 0.1 part of dicyclohexylcarbodiimide and mix for 10 minutes, then transfer the mixture to the casting equipment for melting, rolling Stretching, stretching, embossing, trimming, pre-shrinking, winding, and finally the finished product.

[0029] The product performance test results are as follows: the volume resistivity is 1.0×10 16 , the light transmittance is 92%, the glass / film peel strength is 40N / cm; the degree of cross-linking is 82%; the aging resistance is qualified. All the above indicators have reached the national standard of photovoltaic module encapsulation film. The photovoltaic module encapsulated by the adhesive film has a PID of 4.0%, which is less than the industry's 5% requirement.

Embodiment 2

[0031] 100 parts of EVA, 1 part of benzoyl peroxide, 0.1 part of 2,6-di-tert-butyl-4-methylphenol, 0.1 part of vinyltriethoxysilane, 0.5 part of bis-2,2 sebacic acid, 6,6-Tetramethylpiperidinol ester, put into the mixing equipment and mix for 30 minutes, then add 1 part of dicyclohexylcarbodiimide and mix for 10 minutes, then transfer the mixture to the casting equipment for melting, rolling Stretching, stretching, embossing, trimming, pre-shrinking, winding, and finally the finished product.

[0032] The product performance test results are as follows: the volume resistivity is 1.0×10 16 , the light transmittance is 92%, the glass / film peel strength is 40N / cm; the degree of cross-linking is 82%; the aging resistance is qualified. All the above indicators have reached the national standard of photovoltaic module encapsulation film. The photovoltaic module encapsulated by the adhesive film has a PID of 2.0%, which is less than the industry's 5% requirement.

Embodiment 3

[0034] 50 parts of EVA, 50 parts of POE, 1 part of benzoyl peroxide, 0.1 part of 2,6-di-tert-butyl-4-methylphenol, 0.1 part of vinyl tris(2-methoxyethoxy)silane , 0.5 parts of 2,2'-methylenebis[6-(benzotriazol-2-yl)-4-tert-octylphenol, put into the mixing equipment and mix for 30 minutes, then add 0.1 parts of dicyclohexyl carbon The diimine is mixed for 10 minutes, and then the mixed material is transferred to casting equipment for melting, rolling, stretching, embossing, trimming, pre-shrinking, and winding to finally obtain the finished product.

[0035] Product performance test results are as follows: volume resistivity 5.0×10 16 , the light transmittance is 93%, the glass / film peel strength is 42N / cm; the degree of cross-linking is 82%; the aging resistance is qualified. All the above indicators have reached the national standard of photovoltaic module encapsulation film. The photovoltaic module encapsulated by the adhesive film has a PID of 2.0%, which is less than the...

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PUM

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Abstract

The invention discloses a photovoltaic component packaging glue film resistant to potential induced attenuation. The photovoltaic component packaging glue film is composed of, by weight, 0.1-1.0 part of water absorbent, 1.0-2.0 parts of cross-linking agent, 0.1-0.5 part of antioxygen, 0.1-1.0 part of silane coupling agent, 0.5-1.0 part of thermal stabilizer and 100 parts of film forming substance, the film forming substance is ethylene-vinyl acetate copolymer, polyolefin or blend of the both, and the water absorbent is one of dicyclohexylcarbodiimide and 1-ethyl-(3-(dimethylamino) propyl) carbonyl diimide. The photovoltaic component packaging glue film has a function of resisting potential induced attenuation while light transmittance, peeling strength and antiaging performance are unaffected.

Description

(1) Technical field [0001] The invention belongs to the field of hot melt adhesive packaging materials, in particular to a photovoltaic module packaging adhesive film. (2) Technical background [0002] With the advancement of science and technology, the development of solar photovoltaics has enabled human beings to achieve a harmonious state in terms of energy utilization and environmental protection. In recent years, my country's photovoltaic power generation industry has developed rapidly and has become a major producer and exporter of photovoltaic modules. However, with the prolongation of the application time of photovoltaic modules in power stations, the output power has dropped significantly. The results of the study indicated that the components suffered from potential-induced degradation (PID). PID leads to the corrosion of components, and in severe cases, it can cause the power of a component to attenuate by more than 50%, resulting in a serious waste of energy, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J11/06
Inventor 张伟禄齐志敏孔雅洁刘志德徐迪均
Owner WENZHOU UNIVERSITY