Photovoltaic component packaging glue film resistant to potential induced attenuation
A photovoltaic module encapsulation and adhesive film technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of component corrosion, energy waste, power attenuation, etc., achieve reduced conductivity and good processing performance , good compatibility effect
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Embodiment 1
[0028] 100 parts of EVA, 1 part of benzoyl peroxide, 0.1 part of 2,6-di-tert-butyl-4-methylphenol, 0.1 part of vinyltriethoxysilane, 0.5 part of bis-2,2 sebacic acid, 6,6-Tetramethylpiperidinol ester, put into the mixing equipment and mix for 30 minutes, then add 0.1 part of dicyclohexylcarbodiimide and mix for 10 minutes, then transfer the mixture to the casting equipment for melting, rolling Stretching, stretching, embossing, trimming, pre-shrinking, winding, and finally the finished product.
[0029] The product performance test results are as follows: the volume resistivity is 1.0×10 16 , the light transmittance is 92%, the glass / film peel strength is 40N / cm; the degree of cross-linking is 82%; the aging resistance is qualified. All the above indicators have reached the national standard of photovoltaic module encapsulation film. The photovoltaic module encapsulated by the adhesive film has a PID of 4.0%, which is less than the industry's 5% requirement.
Embodiment 2
[0031] 100 parts of EVA, 1 part of benzoyl peroxide, 0.1 part of 2,6-di-tert-butyl-4-methylphenol, 0.1 part of vinyltriethoxysilane, 0.5 part of bis-2,2 sebacic acid, 6,6-Tetramethylpiperidinol ester, put into the mixing equipment and mix for 30 minutes, then add 1 part of dicyclohexylcarbodiimide and mix for 10 minutes, then transfer the mixture to the casting equipment for melting, rolling Stretching, stretching, embossing, trimming, pre-shrinking, winding, and finally the finished product.
[0032] The product performance test results are as follows: the volume resistivity is 1.0×10 16 , the light transmittance is 92%, the glass / film peel strength is 40N / cm; the degree of cross-linking is 82%; the aging resistance is qualified. All the above indicators have reached the national standard of photovoltaic module encapsulation film. The photovoltaic module encapsulated by the adhesive film has a PID of 2.0%, which is less than the industry's 5% requirement.
Embodiment 3
[0034] 50 parts of EVA, 50 parts of POE, 1 part of benzoyl peroxide, 0.1 part of 2,6-di-tert-butyl-4-methylphenol, 0.1 part of vinyl tris(2-methoxyethoxy)silane , 0.5 parts of 2,2'-methylenebis[6-(benzotriazol-2-yl)-4-tert-octylphenol, put into the mixing equipment and mix for 30 minutes, then add 0.1 parts of dicyclohexyl carbon The diimine is mixed for 10 minutes, and then the mixed material is transferred to casting equipment for melting, rolling, stretching, embossing, trimming, pre-shrinking, and winding to finally obtain the finished product.
[0035] Product performance test results are as follows: volume resistivity 5.0×10 16 , the light transmittance is 93%, the glass / film peel strength is 42N / cm; the degree of cross-linking is 82%; the aging resistance is qualified. All the above indicators have reached the national standard of photovoltaic module encapsulation film. The photovoltaic module encapsulated by the adhesive film has a PID of 2.0%, which is less than the...
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