Backboard used in photovoltaic battery pack and photovoltaic battery pack
A photovoltaic module and backplane technology, applied in photovoltaic power generation, electrical components, circuits, etc., can solve problems such as low performance of components, deterioration and reduction of passivation effect on the surface of cells, and achieve the effect of reducing the risk of PID
Inactive Publication Date: 2017-02-22
SUZHOU GOLDEN STAR ELECTRONICS TECH CO LTD
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Problems solved by technology
[0002] In the current existing technology, the backplane of the photovoltaic cell module is insulated, and the existing photovoltaic cell module has a difficult problem, that is, PID (potential-induced decay), and the photovoltaic module is under high voltage for a long time, so that the packaging glass, other There is a leakage current between the packaging materials, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, reduces FF, lsc, and Voc, and makes the performance of the module lower than the design standard. At present, there is no simple and low-cost technology Solution to improve the anti-PID ability of components
Method used
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0024] Such as figure 1 As shown, a backplane applied to a photovoltaic module includes a backplane substrate 2 and a conductive layer 3 provided on the lower surface of the backplane substrate 2, the interlayer of the backplane substrate 2 or the upper surface of the backplane substrate 2, figure 1 Among them, the conductive layer 3 is provided on the lower surface of the backplane substrate 2 .
[0025] Preferably, the conductive layer is a metal conductive laye...
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Abstract
The invention discloses a backboard used in a photovoltaic battery pack and the photovoltaic battery pack using the backboard. The backboard comprises a backboard base body and conducting layers arranged on the lower surface of the backboard base body, an interlayer of the backboard base body or the upper surface of the backboard base body. The backboard used in the photovoltaic battery pack and the photovoltaic battery pack using the backboard have the advantages that the conducting layers are arranged on the lower surface of the backboard base body, the interlayer of the backboard base body or the upper surface of the backboard base body, when the photovoltaic battery pack is constructed, the conducting layers are electrically connected with a metal framework, and the metal framework is electrically connected with a grounded support, so that both the overall framework and the backboard form an equipotential body, and thus the risk of appearance of PID is sharply lowered. The arrangement of metal conducting layers (preferably choosing aluminum film which has the highest cost performance) or graphite conducting layers having good heat conduction on the lower surface of the backboard can eliminate the risk of the PID and at the same time provide a better heat dissipation effect for the battery pack as a radiator with a large area, and thus the purpose of 'kill two birds with one stone' can be achieved.
Description
technical field [0001] The invention relates to the field of photovoltaic cell components, and more specifically, relates to a back plate applied to a photovoltaic cell component and a photovoltaic cell component. Background technique [0002] In the current existing technology, the backplane of the photovoltaic cell module is insulated, and the existing photovoltaic cell module has a difficult problem, that is, PID (potential-induced decay), and the photovoltaic module is under high voltage for a long time, so that the packaging glass, other There is a leakage current between the packaging materials, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, reduces FF, lsc, and Voc, and makes the performance of the module lower than the design standard. At present, there is no simple and low-cost technology The scheme improves the anti-PID ability of components. Contents of the invention [0003] T...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L31/049H01L31/054H01L31/02
CPCY02E10/52H01L31/049H01L31/02008H01L31/052
Inventor 张丽萍高瑞丁晶
Owner SUZHOU GOLDEN STAR ELECTRONICS TECH CO LTD