Photovoltaic module backboard and photovoltaic cell module

Abstract

The invention discloses a photovoltaic module backboard and a photovoltaic module using the backboard. The backboard comprises a backboard base and a conductive layer which is arranged on the lower surface of the backboard base, the base interlayer or the upper surface of the base. The technical advantages of the photovoltaic module backboard and the photovoltaic module using the backboard are that the conductive layer is arranged on the lower surface of the backboard base, the base interlayer or the upper surface of the base, the conductive layer is electrically connected with a metal frame when the photovoltaic cell module is assembled, and the metal frame is electrically connected with a grounded support so that the whole frame and the backboard form an isopotential body, and the risk of PID can be greatly reduced. The metal conductive layer (the most cost-efficient aluminum film is preferably selected) or the graphite conductive layer of great heat conduction is arranged on the lower surface of the backboard so that the hidden trouble of PID can be eliminated, the conductive layer can act as a large-area heat radiator to provide a better heat radiation effect for the cell module and thus the photovoltaic module backboard and the photovoltaic module using the backboard are dual-purpose.

Description

technical field [0001] The invention relates to the field of photovoltaic cell components, and more specifically, to a photovoltaic component backplane and a photovoltaic cell component. Background technique [0002] In the current existing technology, the backplane of the photovoltaic cell module is insulated, and the existing photovoltaic cell module has a difficult problem, that is, PID (potential-induced decay), and the photovoltaic module is under high voltage for a long time, so that the packaging glass, other There is a leakage current between the packaging materials, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, reduces FF, lsc, and Voc, and makes the performance of the module lower than the design standard. At present, there is no simple and low-cost technology The scheme improves the anti-PID ability of components. Contents of the invention [0003] The purpose of the present i...

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Problems solved by technology

[0002] In the current existing technology, the backplane of the photovoltaic cell module is insulated, and the existing photovoltaic cell module has a difficult problem, that is, PID (potential-induced decay), and the photovoltaic module is under high voltage for a long time, so that the packaging glass, other There is a leakage current between the packaging materials, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, reduces FF, lsc, and Voc, and makes the performance of the module lower than the design standard. At present, there is no simple and low-cost technology Solution to improve the anti-PID ability of components

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