Backing plate applied to photovoltaic battery module and photovoltaic battery module

Abstract

The invention discloses a backing plate applied to a photovoltaic battery module and the photovoltaic battery module adopting the backing plate. The backing plate comprises a backing plate basal body and a conducting layer arranged on the lower surface of the backing plate basal body, the sandwich layer of the basal body or the upper surface of the basal body. The backing plate has the technological advantages that the conducting layer is arranged on the lower surface of the backing plate basal body, the sandwich layer of the basal body or the upper surface of the basal body, the conducting layer is electrically connected with a metal frame when the photovoltaic battery module is established, and an isopotential body is formed by the whole frame and the backing plate since the metal frame is electrically connected due to a grounded support, so that the risk that PID appears is greatly reduced. A metal conducting layer (preferably an aluminum film with the maximum cost performance) or a graphite conducting layer with good heat conduction is arranged on the lower surface of the backing plate, a better heat dissipation effect is provided for the battery module by a large-area heat dissipator while the hidden danger of PID is eliminated, so that two purposes are achieved.

Description

technical field [0001] The invention relates to the field of photovoltaic cell components, and more specifically, relates to a back plate applied to a photovoltaic cell component and a photovoltaic cell component. Background technique [0002] In the current existing technology, the backplane of the photovoltaic cell module is insulated, and the existing photovoltaic cell module has a difficult problem, that is, PID (potential-induced decay), and the photovoltaic module is under high voltage for a long time, so that the packaging glass, other There is a leakage current between the packaging materials, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, reduces FF, lsc, and Voc, and makes the performance of the module lower than the design standard. At present, there is no simple and low-cost technology The scheme improves the anti-PID ability of components. Contents of the invention [0003] T...

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Problems solved by technology

[0002] In the current existing technology, the backplane of the photovoltaic cell module is insulated, and the existing photovoltaic cell module has a difficult problem, that is, PID (potential-induced decay), and the photovoltaic module is under high voltage for a long time, so that the packaging glass, other There is a leakage current between the packaging materials, and a large amount of charge accumulates on the surface of the cell, which deteriorates the passivation effect of the cell surface, reduces FF, lsc, and Voc, and makes the performance of the module lower than the design standard. At present, there is no simple and low-cost technology Solution to improve the anti-PID ability of components

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