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Cleaning device and cleaning method

A technology for cleaning devices and cleaning liquids, applied in cleaning methods and utensils, cleaning methods using liquids, cleaning methods using tools, etc., capable of solving problems such as insufficient cleaning

Active Publication Date: 2020-07-07
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Regardless of chemical cleaning or rinse cleaning, if there is a portion of the substrate where the flow of the cleaning liquid is low or where the cleaning liquid is deposited, slurry residues and / or particles such as metal grinding dust remain in this portion , thus cleaning becomes insufficient

Method used

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  • Cleaning device and cleaning method
  • Cleaning device and cleaning method
  • Cleaning device and cleaning method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0092] figure 2 (a) is a plan view showing the positional relationship between the substrate and the single-tube nozzle in the cleaning apparatus of the first embodiment, figure 2 (b) is figure 2 Front view of (a). figure 2 (a) and (b) represent the supply of the cleaning liquid to the surface of the flat substrate by a single-tube nozzle. The single-pipe nozzle 41 as a cleaning liquid supply nozzle discharges the cleaning liquid L from the outside of the upper space of the substrate W toward the surface (upper surface) of the substrate W above the substrate W. That is, the single-tube nozzle 41 supplies the rinse liquid L to the surface of the substrate W from obliquely above. The flushing liquid L may be ultrapure water (DIW), or functional water such as hydrogen water.

[0093] The position, discharge direction, diameter, and flow velocity of the single-tube nozzle 41 are designed so that the rinse liquid L discharged from the single-tube nozzle 41 satisfies the fol...

no. 2 Embodiment approach

[0100] image 3 (a) is a plan view showing the positional relationship between the substrate, the single-pipe nozzle, and the spray nozzle in the cleaning apparatus of the second embodiment, image 3 (b) is image 3 Front view of (a). image 3 (a) and (b) represent the supply of the cleaning liquid to the surface of the flat substrate by the single-tube nozzle and the spray nozzle. The single-pipe nozzle 41 as a cleaning liquid supply nozzle has the same structure as that of the first embodiment. In this embodiment, a spray nozzle 42 is further added to the first embodiment as a cleaning liquid supply nozzle. The discharge of the rinse liquid L1 by the single-tube nozzle 41 is performed simultaneously with the spraying of the rinse liquid L2 by the spray nozzle 42 .

[0101] like image 3 As shown in (b), the spray nozzle 42 sprays the rinse liquid L2 from the outside of the upper space of the substrate W toward the surface (upper surface) of the substrate W above the sub...

no. 3 Embodiment approach

[0106] Figure 4 (a) is a plan view showing the positional relationship between the substrate and the two single-tube nozzles in the cleaning apparatus of the third embodiment, Figure 4 (b) is Figure 4 Front view of (a). Figure 4 (a) and (b) represent supply of the cleaning liquid to the flat substrate surface by two single-tube nozzles. The first single-pipe nozzle 41 has the same configuration as that of the first embodiment. In this embodiment, a second single-pipe nozzle 43 is added to the first embodiment. The discharge of the rinse liquid L1 by the one-tube nozzle 41 is performed simultaneously with the discharge of the rinse liquid L3 by the one-tube nozzle 43 . like Figure 4 As shown in (b), the single nozzle 43 is above the substrate W, and discharges the rinse liquid L3 from the outside of the upper space of the substrate W toward the surface (upper surface) of the substrate W. That is, the single-tube nozzle 43 supplies the rinse liquid L3 to the surface o...

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Abstract

In a cleaning apparatus that cleans a substrate while supplying a cleaning liquid to the surface of a substrate such as a rotating semiconductor wafer, the degree of cleaning is improved by flowing the cleaning liquid over the entire radius of the substrate. The cleaning device has: a plurality of spindles (51) that hold the substrate (W) and rotate the substrate (W) with the central axis of the substrate (W) as a rotation axis; The single-tube nozzle (41) of the liquid (L), the single-tube nozzle (41) lands on the front of the center (O) of the substrate W with the cleaning liquid (L), and the cleaning liquid (L) landed on the substrate (W) The cleaning liquid (L) is discharged in such a way that the upper surface of the substrate (W) flows towards the center of the substrate (W). The flow of the cleaning liquid (L) discharged from the single-pipe nozzle (41) after landing on the upper surface of the substrate (W) passes through the center (O) of the substrate (W).

Description

technical field [0001] The present invention relates to a cleaning device and a cleaning method for cleaning a substrate while supplying a cleaning solution to the surface of a substrate such as a rotating semiconductor wafer. Background technique [0002] The manufacturing process of a substrate such as a semiconductor wafer includes a polishing step of polishing a film of metal or the like formed on the substrate, and after the polishing step, cleaning is performed to remove fine particles of polishing debris. For example, in a damascene wiring formation process in which wiring grooves formed in an insulating film formed on the surface of a substrate are filled with a metal, the damascene wiring is removed by chemical mechanical polishing (CMP) after the damascene wiring is formed. Excess metal on the substrate surface. On the surface of the substrate after CMP, residues of the slurry used for CMP (slurry residues) and particulate matter (defects) such as metal grinding s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/02B08B3/08B08B1/02B08B13/00H01L21/67F26B5/08F26B21/00
CPCB08B3/02B08B13/00H01L21/02057
Inventor 石桥知淳
Owner EBARA CORP