Method and system for replacing chemical agent on machine

A chemical preparation and machine technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as prone to errors and replacement errors.

Active Publication Date: 2015-10-14
SEMICON MFG INT TIANJIN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In view of the above existing problems, the present invention discloses a method and system for replacing chemical preparations on the machine, so as to overcome the artificial replacement of the chemical preparations required by the alarm sound of the machine in the prior art, which is prone to errors, resulting in replacement errors The problem

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  • Method and system for replacing chemical agent on machine
  • Method and system for replacing chemical agent on machine
  • Method and system for replacing chemical agent on machine

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Embodiment Construction

[0053] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0054] figure 1 It is a schematic flow chart of the method for replacing the chemical preparation on the machine in the embodiment of the present invention; as figure 1 Shown:

[0055] This embodiment relates to a method for replacing chemical preparations on a machine table, which is applied to a machine table provided with several slots, and each slot is preset with a container containing chemical preparations. The method includes the following steps :

[0056] Step S1, corresponding to each slot position, a number of ready-to-use containers containing corresponding chemical preparations are provided. Preferably, each of the ready-to-use containers has an updated barcode that meets the process requirements, and the chemical preparation is hexamethyl di Hexamethyldisilazane (HMDS for short);...

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Abstract

The invention discloses a method for replacing a chemical agent on a machine. The method comprises steps of timely collecting alarm information of the machine through an EAP system; extracting effective alarm information of the chemical agent from the alarm information according to a preset rule to obtain a third data set; storing the third data set in a data base; a control system extracting attribute information of a slot for replacing the chemical agent from a second data set according to the third data set stored in the data base and extracting and outputting attribute information of a to-be-replaced vessel from a first data set according to the attribute information of the slot for replacing the chemical agent; replacing the chemical agent according to concrete information output by the control system; and adopting a comparison module to compare update bar code information of the to-be-replaced vessel and an empty preset vessel during replacement of the chemical agent. Therefore, alarm data can be accurately and timely collected, and the high effectiveness and accuracy of chemical agent replacement of the machine can be ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method and system for replacing chemical preparations on a machine. Background technique [0002] The manufacturing process of integrated circuits is extremely complicated, and many chemical agents are usually used. Taking Hexamethyldisilazane (HMDS) as an example, the photolithography process (Photolithography) in the yellow light area (Litho) is integrated. At the core of circuit manufacturing, there is an important glue coating process in the photolithography process. In this gluing process, most of the photoresist used is hydrophobic, while the hydroxyl groups and residual water molecules on the wafer surface are hydrophilic. In order to solve the problem that direct spin-coating of photoresist on the wafer surface may cause local gaps or bubbles due to poor adhesion between photoresist and wafer, which may affect the photolithography and development ef...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/67
Inventor尹浩马擎张健郭伟凯
OwnerSEMICON MFG INT TIANJIN