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Processing method of suspension-structure gold finger, and circuit board

A technology of suspended structure and processing method, which is applied in the direction of multilayer circuit manufacturing, printed circuit components, electrical connection printed components, etc., can solve the problems of waste of resources, cost, poor versatility, and strong limitations, so as to save resources and costs, Reduce cost and waste of resources, strong versatility

Active Publication Date: 2015-10-14
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a processing method and a circuit board of a gold finger with a suspended structure, so as to solve the technical problems of existing gold finger circuit boards, which have strong limitations, poor versatility, and easily lead to resource waste and cost increase.

Method used

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  • Processing method of suspension-structure gold finger, and circuit board
  • Processing method of suspension-structure gold finger, and circuit board
  • Processing method of suspension-structure gold finger, and circuit board

Examples

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Embodiment 1

[0027] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a gold finger with a suspended structure, which may include:

[0028] 110. Provide a plurality of gold finger copper modules with different thicknesses, the gold finger copper module includes a copper plate area and at least one copper strip extending from one side of the copper plate area, and the copper strip is divided into an exposed area close to the copper plate area and the press-fit area away from the copper plate area.

[0029] In the embodiment of the present invention, the gold finger copper module provided is as Figure 2a As shown, the gold finger copper module 20 includes a copper plate area 21 and at least one copper strip 22 extending from one side of the copper plate area. The copper strip 22 can be divided into an exposed area 2201 close to the copper plate area and a pressing area far away from the copper plate area. 2202. In one embodiment, the manuf...

Embodiment 2

[0054] Please refer to Figure 2f and 2g , an embodiment of the present invention provides a circuit board with gold fingers in a suspended structure, the circuit board may include:

[0055] The circuit board body 30 and the suspended structure gold finger 37, one end of the suspended structure gold finger 37 is embedded in the circuit board body, and the other end extends from one side of the circuit board body, and the suspended structure gold finger includes multiple layers, each layer includes at least one gold finger 37, and the gold finger 37 is a gold-plated copper strip structure.

[0056] The circuit board body may include multiple circuit layers, and each golden finger 37 may be connected to at least one of the multiple circuit layers through metallized through holes 35 .

[0057] The circuit board provided by the embodiment of the present invention can be manufactured by the method of the first embodiment. For a more detailed description, please refer to Embodime...

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Abstract

The invention discloses a processing method of a suspension-structure gold finger, and a circuit board, for solving the technical problems of quite high restrictions, very poor versatility and high proneness to waste of resources and increase of the cost existing in a conventional gold finger circuit board. The method comprises the following steps: providing multiple gold finger copper modules with different thicknesses; pressing a multilayer board, wherein the multiple g gold finger copper modules are pressed at different levels of the internal layer of the multilayer board; processing a group of conduction holes outside a formation area of the multilayer board, wherein the conduction holes are connected with copper board areas of the gold finger copper modules; removing the portion apart from the formation area of the multilayer board through controlled depth milling yet reserving the gold finger copper modules; gilding copper bars of the gold finger modules; and processing the non copper bar portion apart from the formation area of the multilayer board through controlled depth milling so as to enable the copper bars to be the gold fingers of suspension structures.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for processing golden fingers with a suspended structure and a circuit board. Background technique [0002] At present, the structural design of printed circuit board (PCB) boards with gold fingers generally adopts the method of involving the gold fingers within the forming area of ​​the surface layer of the circuit board. The gold finger that provides the plug-in function should match the size of the plug-in interface. The thickness of the gold-finger circuit board should be consistent with the opening height of the plug-in interface. When the opening height of the plug-in interface is fixed, the circuit where the gold finger is located The plate thickness is thus fixed. [0003] When the thickness of the gold finger circuit board needs to be increased to achieve multi-functional requirements, the supporting plug-in interface equipment needs to be completely cha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/46H05K1/11
Inventor 刘宝林郭长峰丁大舟缪桦
Owner SHENNAN CIRCUITS