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Folded substrate integrated waveguide broadband bandpass filter loaded with t-shaped defect ground

A substrate-integrated waveguide and band-pass filter technology, applied in waveguide-type devices, circuits, electrical components, etc., can solve the problems of high operating frequency, narrow bandwidth, restricted application range, etc., and achieve low profile, light weight, easy to use. integrated effects

Active Publication Date: 2019-01-22
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the help of printed circuit technology, low-cost mass production of filters based on substrate-integrated waveguides becomes possible. However, ordinary substrate-integrated waveguide bandpass filters have high operating frequencies and narrow bandwidths, which restrict their application. Application range

Method used

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  • Folded substrate integrated waveguide broadband bandpass filter loaded with t-shaped defect ground
  • Folded substrate integrated waveguide broadband bandpass filter loaded with t-shaped defect ground
  • Folded substrate integrated waveguide broadband bandpass filter loaded with t-shaped defect ground

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Experimental program
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Effect test

specific Embodiment approach 1

[0007] Specific implementation mode one: combine figure 1 and figure 2 To illustrate this embodiment, the folded substrate integrated waveguide broadband bandpass filter loaded with a T-shaped defect ground in this embodiment includes a dielectric substrate 1, a first microstrip line 2, two second microstrip lines 3, two second microstrip lines One T-shaped defect structure 4, two second T-shaped defect structures 5 and five third T-shaped defect structures 6, the dielectric substrate 1 is composed of a rectangular plate 1-1 and a semicircular plate 1-2, the rectangular plate The right end of the plate 1-1 is connected to the straight edge of the semicircular plate 1-2, and the first microstrip line 2 is printed on the right end of the dielectric substrate 1, including the right end of the rectangular plate 1-1 and the semicircular plate 1. -2, two second microstrip lines 3 are printed on both sides of the left end of the rectangular plate 1-1, and the right end of each seco...

specific Embodiment approach 2

[0008] Specific implementation mode two: combination figure 1 and figure 2 Describe this embodiment, each second microstrip line 3 of the folded substrate integrated waveguide broadband bandpass filter loaded with a T-shaped defect in this embodiment is composed of a first long microstrip line 3-1, a trapezoidal microstrip The line 3-2 and the second long microstrip line 3-3 are connected end to end in sequence.

[0009] The technical effect of this implementation mode is: such setting can make the filter obtain good impedance matching characteristics. Other components and connections are the same as those in the first embodiment.

specific Embodiment approach 3

[0010] Specific implementation mode three: combination figure 1 and figure 2 Describe this embodiment, the folded substrate integrated waveguide broadband bandpass filter loaded with T-shaped defects in this embodiment is characterized in that: the length of the dielectric substrate 1 is 166.8 mm, the width of the dielectric substrate 1 is 63.6 mm, and the dielectric The thickness of the substrate 1 is 1.5-1.6mm, and the relative dielectric constant is 4.3-4.6.

[0011] The technical effect of this embodiment: in such an arrangement, a substrate with a higher dielectric constant is used to make the filter smaller in size, and other components and connections are the same as those in Embodiment 1.

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Abstract

A folded substrate integrated waveguide wideband band-pass filter loaded with a T-shaped defected ground relates to a substrate integrated waveguide wideband band-pass filter, and specifically relates to a folded substrate integrated waveguide wideband band-pass filter loaded with a T-shaped defected ground. The invention aims to solve the problem that the development of an ordinary substrate integrated waveguide band-pass filter in a mobile communication system is limited due to high working frequency and narrow bandwidth. The folded substrate integrated waveguide wideband band-pass filter comprises a dielectric substrate, a first micro-strip line, two second micro-strip lines, two first T-shaped defected ground structures, two second T-shaped defected ground structures, and five third T-shaped defected ground structures. The dielectric substrate is composed of a rectangular plate and a semicircular plate, and the right end of the rectangular plate and the straight edge of the semicircular plate are connected as a whole. The first micro-strip line is printed on the right end of the front of the rectangular plate, the two second micro-strip lines are respectively printed on the two sides of the left end of the rectangular plate, and the right end of each second micro-strip line is connected with the first micro-strip line. The folded substrate integrated waveguide wideband band-pass filter of the invention is used in the field of wireless communication.

Description

technical field [0001] The invention relates to a substrate-integrated waveguide broadband bandpass filter, in particular to a folded substrate-integrated waveguide broadband bandpass filter loaded with a T-shaped defect, which belongs to the field of wireless communication. Background technique [0002] Substrate-integrated waveguide is a waveguide structure that achieves transmission characteristics similar to metal rectangular waveguides on a dielectric substrate. Due to the advantages of low radiation, miniaturization, and easy integration, this structure has become a research hotspot and is also widely used in filtering device design. With the help of printed circuit technology, low-cost mass production of filters based on substrate-integrated waveguides becomes possible. However, ordinary substrate-integrated waveguide bandpass filters have high operating frequencies and narrow bandwidths, which restrict their application. application range. Contents of the inventio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20H01P1/203
Inventor 林澍赵志华王蕾刘冠君罗晓王立娜
Owner HARBIN INST OF TECH