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Stockpot

A soup pot and pot lid technology, which is applied to special materials of cooking utensils, lids of cooking utensils, cooking utensils, etc., can solve the problems of large heat loss, unfavorable energy saving, etc., and achieve the effect of fast heat conduction

Inactive Publication Date: 2015-11-25
于洋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, most of the ordinary soup pots on the market are single-layer metal products, and the heat transfer and heat dissipation of metal are relatively fast. When heating, the heat loss is also large, which is not conducive to energy saving.

Method used

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  • Stockpot

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Such as figure 1 As shown, a soup pot, the soup pot includes a pot body 1 and a pot cover 2, the pot body 1 and the pot cover 2 are three-layer structure, the pot body 1 includes a pot wall and a pot bottom, wherein the pot wall Including inner layer pot wall 11 and outer layer pot wall 12, described pot bottom comprises inner layer pot bottom 13 and outer layer pot bottom 14, and described pot cover 2 comprises inner layer pot cover 22 and outer layer pot cover 21, described Between the inner pot wall 11 and the outer pot wall 12 is an expanded perlite filling layer 3, between the inner pot cover 22 and the outer pot cover 21 is an expanded perlite filling layer 3, and the inner layer Between the bottom of the pot 13 and the bottom of the outer layer of the pot 14 is a heat-conducting metal layer 4, the thickness of the heat-conducting metal layer 4 is between 0.3mm and 1.5mm; Expanded perlite filling layer 3 is added between the outer layers, so that the effect of he...

Embodiment 2

[0019] Such as figure 1 As shown, a soup pot, the soup pot includes a pot body 1 and a pot cover 2, the pot body 1 and the pot cover 2 are three-layer structure, the pot body 1 includes a pot wall and a pot bottom, wherein the pot wall Including inner layer pot wall 11 and outer layer pot wall 12, described pot bottom comprises inner layer pot bottom 13 and outer layer pot bottom 14, and described pot cover 2 comprises inner layer pot cover 22 and outer layer pot cover 21, described Between the inner pot wall 11 and the outer pot wall 12 is an expanded perlite filling layer 3, between the inner pot cover 22 and the outer pot cover 21 is an expanded perlite filling layer 3, and the inner layer Between the bottom of the pot 13 and the bottom of the outer layer of the pot 14 is a heat-conducting metal layer 4, the thickness of the heat-conducting metal layer 4 is between 0.3mm and 1.5mm; Expanded perlite filling layer 3 is added between the outer layers, so that the effect of he...

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PUM

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Abstract

The invention discloses a stockpot which comprises a pot body and pot covers, wherein the pot body and the pot covers are in three-layer structures, the pot body comprises pot walls and pot bottoms, an expanded perlite filling layer is arranged between the inner-layer pot wall and the outer-layer pot wall, another expanded perlite filling layer is arranged between the inner-layer pot cover and the outer-layer pot cover, and a heat conduction metal layer is arranged between the inner-layer pot bottom and the outer-layer pot bottom, and has the thickness of 0.3mm-1-5mm. According to the stockpot, the three-layer structures are adopted, the expanded perlite filling layers are arranged between the inner layer and the outer layer of the pot wall, and between the inner layer and the outer layer of the pot cover, respectively, thus the heat insulation effect is achieved through the expanded perlite filling layers with the thickness of 1cm-2cm, and the minimum dissipation of heat is guaranteed; by arranging the heat conduction metal layer made of red copper but not limited to red copper between the inner layer and the outer layer of the pot bottom, the heat conduction of the pot bottom is rapid.

Description

technical field [0001] The invention relates to the field of daily necessities, in particular to a soup pot. Background technique [0002] At present, ordinary soup pots on the market are mostly single-layer metal products, and the heat transfer and heat dissipation of metal are relatively fast. When heating, the heat loss is also large, which is not conducive to energy saving. There is also the birth of new double-layer pots, most of which are made of metal. There are vacuum interlayers on the sides and bottom of the pot. The interlayer on the side of the pot helps to reduce heat loss, while the interlayer on the bottom of the pot is not conducive to heat transfer. Contents of the invention [0003] In view of the above-mentioned deficiencies existing in the current soup pot, the present invention provides a soup pot with fast heat conduction, minimum dissipation of heat and energy saving. [0004] In order to achieve the above object, embodiments of the present inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A47J27/00A47J36/04A47J36/06
Inventor 于洋
Owner 于洋
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