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Modular computer and thermal management

A computer, modular technology, applied in computing, energy-saving computing, electrical digital data processing, etc., can solve problems such as sufficient generation in an effective way, high cooling power consumption, etc.

Inactive Publication Date: 2015-12-02
ICE COMP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these new "tiny" products do not generate enough airflow in an efficient manner to cool the high power consumption microprocessors

Method used

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  • Modular computer and thermal management
  • Modular computer and thermal management
  • Modular computer and thermal management

Examples

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Embodiment Construction

[0024] figure 1 is a top view of the computer core 200 and a partial view of the connected computing device 100 . Such as figure 1 As shown, computer core 200 is the size of a smartphone and is designed to connect to computing device 100 . On the backplane 250, the computer core 200 includes: a central processing unit (CPU) 201c, a graphics processing unit (GPU) 201g, an embedded controller 201e, and other computing components. In some embodiments, computing core 200 and computing device 100 are connected in any manner (eg, horizontally, vertically, or using a rotation mechanism at an angle of less than 270 degrees) by base connector 220 and carrier connector 120 . To simplify this detailed description, components on computing device 100 are described as "carriers," while components on computer core 200 are described as "pedestals." The pins of these connectors (eg, USB pins, A / V pins, power consumption pins, and data pins) are functionally mapped to allow appropriate sig...

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Abstract

An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets.

Description

[0001] Cross References to Related Applications [0002] This application is related to and claims priority to US Provisional Application Serial No. 61 / 776,682, filed March 11, 2013, entitled "Modular Computer and Thermal Management" ("co-pending provisional application"). The entire contents of the co-pending provisional application are hereby incorporated by reference. technical field [0003] The invention relates to the application of modular computer cores. More specifically, the present invention relates to the use of a hybrid circuit comprising a high power consumption processor and a low power consumption processor to provide selectable "thermal design power" (TDP) in a thermal module along with airflow design. Background technique [0004] In recent years, small and thin computing devices have become highly popular. Some examples of small and thin computing devices include the iPad and iPhone from Apple Computer, Inc., the "ultrabook" notebook computer from Intel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K5/00
CPCG05D7/0676G06F1/20G06F1/3293G06F2200/1635Y02D10/00
Inventor 郑尚澈吴为翰林佳民
Owner ICE COMP
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