Stamped split system

Abstract

The invention provides a stamping type lobing system, comprising: an impact plate, a groove plate and a control module; the impact plate is equipped with an impact head for impacting the disc to be divided, at least one impact head, and the impact heads are evenly distributed on the impact plate ; The groove plate is provided with a groove matching the impact head, at least one groove is evenly distributed on the groove plate; the number of impact heads and grooves is the same as the number of crystal grains on the wafer to be divided The same; the control module is used to control the impact head of the impact plate to impact the wafer to be divided on the groove plate, and to control the impact head to impact the wafer to be divided to the groove of the groove plate. The stamping split system provided by the invention can improve the production efficiency of splits, and further improve the yield of split products.

Description

technical field [0001] The invention relates to the field of light-emitting diode manufacturing, in particular to a stamping split system. Background technique [0002] In the production process of light emitting diode (Light Emitting Diode, referred to as LED) chips, the splitting process is a key step related to the final yield of the finished product. The connected dies in the wafer are separated into individual units, and the connected dies are separated from each other to form core dies. [0003] At present, in the process of dividing the COW wafer into independent individual grains, the splitting device in the splitter is mainly used to exert a certain impact force on the COW wafer between the grain and the cutting line of the grain, and the COW The wafer is cleaved into individual dies. However, the splitting tool of the splitting device in the current splitting machine mainly uses a cuboid shape, which can only split one row of grains in the X direction or Y direct...

AI Technical Summary

Problems solved by technology

However, the splitting tool of the splitting device in the current splitting machine mainly uses a cuboid, which can only split one row of grains in the X direction or Y direction at a time, which consumes a long time and the machine capacity is low.

[0004] Therefore, in the process of dividing the COW wafer into independent individual grains by using the current splitter, since the splitting tool of the splitter in the splitter can only split a row of grains in the X direction or the Y direction at a time, time consumption Longer, reducing the efficiency of die splitting from COW wafers

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