A temperature measuring wafer fine-tuning device
A technology for fine-tuning devices and wafers, which is applied to measurement devices, thermometers, and heat measurement, etc., can solve the problem that the test results cannot meet the requirements of the expected temperature uniformity index, and achieve the effects of improving test efficiency, simple operation and simple structure.
Active Publication Date: 2017-07-28
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
[0002] At present, in the production process of semiconductor wafers, the requirements for the temperature uniformity of the hot plate surface are getting higher and higher. When the plate body after normal production and assembly is tested for the temperature uniformity of the hot plate surface, due to some manufacturing errors and assembly errors, The test results often fail to meet the expected temperature uniformity index requirements of the disk surface. If the substandard disk body can be properly adjusted to meet the use requirements, it will greatly save equipment costs and prevent waste products due to substandard performance. On the existing basis, further improve the temperature uniformity index requirements of the disk surface to meet the increasingly complex and precise process requirements in the future
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[0020] The present invention will be described in further detail below with reference to the drawings.
[0021] Such as Figure 1~2 As shown, the present invention includes a PIN needle 1, a PIN needle lifting support 2, a linear guide 3, a linear guide support 4, a micrometer 5, a tray 6 and a tray support 7, wherein the tray 6 is supported by three tray supports 7, The linear guide rail support 4 is fixedly mounted on the tray 6 by bolts, and the center of the linear guide support 4 is provided with a through hole.
[0022] Such as image 3 As shown, the PIN needle lifting support 2 has a "concave" structure with the bottom side removed. A groove 8 is provided in the middle of the PIN needle lifting support 2, and side plates 9 are provided on both sides. The PIN needle 1 is It is installed in the groove 8, and the free end of the PIN needle 1 abutting the measuring wafer extends out of the PIN needle lifting support 2. The groove 8 of the PIN needle lifting support 2 is inserte...
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The invention relates to the field of semiconductor wafer detection, in particular to a temperature measuring wafer fine-tuning device capable of fine-tuning the position between the temperature-measuring wafer and the disk surface in the detection of the temperature uniformity of the semiconductor hot plate, including a PIN needle and a PIN needle lift Support, linear guide rail support, micrometer and tray, wherein the linear guide rail support is fixed on the tray, and the PIN needle lifting support is installed on the linear guide rail support in a liftable manner. The middle part of the PIN needle lifting support There is a groove, the PIN needle is installed in the groove of the PIN needle lifting support, the groove is inserted into the linear guide support, and a micrometer is installed on the lower side of the tray, and the measurement of the micrometer The free end of the round rod is inserted into the linear guide rail support and abuts against the bottom surface of the groove of the PIN needle lifting support, so that the height of the PIN needle can be adjusted through the micrometer. The invention has simple structure, high test efficiency and can quantify test indexes.
Description
Technical field [0001] The invention relates to the field of semiconductor wafer inspection, in particular to a temperature-measuring wafer fine-tuning device capable of fine-adjusting the position between the temperature-measuring wafer and the disk surface in the temperature uniformity inspection of a semiconductor hot plate. Background technique [0002] At present, in the semiconductor wafer production process, the requirements for the temperature uniformity of the hot plate surface are getting higher and higher. When the plate body after normal production and assembly is tested for the temperature uniformity of the hot plate surface, due to some manufacturing and assembly errors, The test results often fail to meet the expected disc surface temperature uniformity index requirements. If the disc body that does not meet the standard can be appropriately adjusted to meet the use requirements, it will greatly save equipment costs, prevent waste products due to substandard perform...
Claims
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IPC IPC(8): G01K1/00
Inventor 尹硕
Owner SHENYANG KINGSEMI CO LTD