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Flexible Substrate

A substrate and base layer technology, applied in circuit inspection/identification, circuit optical components, printed circuits, etc., can solve the problems of small identification code 13, difficulty in identifying identification code 13, and increased interpretation time, etc.

Active Publication Date: 2018-10-19
CHIPBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] see Image 6 , an existing conventional flexible substrate 10, which includes a base layer 11 and a wiring layer 12, the base layer 11 has a first surface 11a and a second surface 11b, the wiring layer 12 is disposed on the base layer 11 On the first surface 11a, an identification code 13 is formed by printing on the second surface 11b of the base layer 11 for manual or photographic device interpretation, but since the identification code 13 is formed on the base layer 11 Therefore, when the identification code 13 is to be read, the flexible substrate 10 must be turned over, and then read from the second surface 11b of the base layer 11, thus increasing the reading time
[0003] In addition, since each manufacturer forms the identification code 13 on the second surface 11b of the base layer 11, the position is not the same, and because the identification code 13 is small, it is difficult to identify the identification code 13 position.

Method used

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Examples

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no. 1 example

[0043] see figure 1 , figure 2 , image 3 and Figure 4 , which is the first embodiment of the present invention, a flexible substrate 100 which includes a base layer 110, a metal layer 120, a solder resist paint layer 130, an identification code 140 and a plurality of transmission holes 150, the base layer 110 has The first surface 111 and the second surface 112 opposite to the first surface 111, the transmission holes 150 communicate with the first surface 111 and the second surface 112 of the base layer 110, and the transmission holes 150 are arranged in sequence On two sides of the base layer 110, the transmission holes 150 are arranged in the direction of transporting the flexible substrate 100, each of the transmission holes 150 has a first area, and the metal layer 120 is formed on the base layer 110. On the first surface 111 , the metal layer 120 has a plurality of lines 121 and a substrate block 122 for defining a marking position.

[0044] see figure 2 and ...

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PUM

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Abstract

The present invention relates to a flexible substrate, which includes a base layer, a metal layer, a solder resist paint layer and an identification code. The metal layer is arranged on the first surface of the base layer. The metal layer has a plurality of circuits and To define the underlay block at the position of the mark, the solder resist paint layer covers the circuit and the underlay block, above the metal layer in the vertical direction of the underlay block, from the outline edge of the underlay block A region to be marked is defined on the exposed surface of the solder resist paint layer, and the identification code is formed in the region to be marked of the solder resist paint layer. The present invention can save the time for inspectors or operators to find the marking position of the identification code by means of the substrate block, and since the identification code uses the substrate block as the substrate, the identification code can be written clearly, so that Avoid manual or photographic device interpretation errors.

Description

technical field [0001] The invention relates to a flexible substrate, in particular to a flexible substrate that is easy to read product identification codes. Background technique [0002] see Image 6 , an existing conventional flexible substrate 10, which includes a base layer 11 and a wiring layer 12, the base layer 11 has a first surface 11a and a second surface 11b, the wiring layer 12 is disposed on the base layer 11 On the first surface 11a, an identification code 13 is formed by printing on the second surface 11b of the base layer 11 for manual or photographic device interpretation, but since the identification code 13 is formed on the base layer 11 Therefore, when the identification code 13 is to be read, the flexible substrate 10 must be turned over, and then read from the second surface 11b of the base layer 11, thus increasing the reading time. [0003] In addition, since each manufacturer forms the identification code 13 on the second surface 11 b of the base l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544
CPCH05K1/0269H05K2201/09781H05K2201/0989H05K2201/09936H05K1/0274H05K1/028H05K1/0298
Inventor 陈怡雯林吟贞柯明孝马宇珍
Owner CHIPBOND TECH