Radiator fixing device and radiator fixing assembly thereof

Abstract

The invention discloses a radiator fixing device and a radiator fixing assembly thereof. The radiator fixing device comprises a heat conduction substrate, at least two elastic fixing arms, and at least two fixing components; the elastic fixing arms are arranged in the heat conduction substrate; each elastic fixing arm is provided with a fixing part, an arm sheet and a buckling claw part, wherein the fixing part is fixed on the heat conduction substrate, the arm sheet extends from the fixing part, and the buckling claw part is C-shaped and is formed at an end of the arm sheet which is opposite to the other end of the arm sheet, wherein the other end of the arm sheet is connected with the fixing part; an open buckling groove is formed at one side of the buckling claw part; a lateral open is formed in the open buckling groove; and the fixing components are detachably arranged in the open buckling grooves of the buckling claw parts respectively through the lateral openings. In a transportation process from a manufacturer to a purchaser, the radiator fixing device of the invention will not be disassembled, and the components of the radiator fixing device will not be lost. According to the radiator fixing device, an anti-slip gasket is omitted, and therefore, the components and structure of the radiator fixing device can be simplified.

Description

technical field [0001] The invention relates to a radiator fixing device, the simplified configuration of which makes the number of parts less than that of the existing radiator fixing device, and can achieve a good fixing effect. Background technique [0002] Existing mobile electronic devices, such as notebook computers, mostly have built-in high-speed semiconductor chips, such as central processing units or display chips. These semiconductor chips generate a lot of waste heat during operation, causing the temperature of itself and surrounding electronic components to rapidly increase. In order to prevent the semiconductor chip and its surrounding electronic components from being burned by high temperature, notebook computer manufacturers will install a heat sink on the semiconductor chip to help the semiconductor chip dissipate waste heat to the outside of the notebook computer. [0003] Existing heat sinks suitable for notebook computers usually have a cooling plate, a h...

AI Technical Summary

Problems solved by technology

[0005] 1. When the manufacturer sells the above-mentioned radiator, in order to prevent the fixing bolts from easily falling off from the perforation of the elastic fixing arm, a gasket is further threaded, which makes the number of parts of the radiator increase and the overall assembly is complicated, and the anti-skid effect provided by the gasket Limited, easy to dislodge from the screw rod of the retaining bolt, so that the retaining bolt is still easy to fall off from the elastic retaining arm, causing assembly problems for notebook computer manufacturers who purchase this type of heat sink

[0006] 2. The structures of the above-mentioned elastic fixing arms, washers and fixing bolts of the heat sink cannot be applied to CPUs with PGA and BGA architectures at the same time, and the heat sink must have different elastic fixing arms and heat pipe gaps for the applicable designs.

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