Method and system for marking special processing figure in optical proximity correction
A technology of optical proximity effect and special processing, which is applied in photomechanical processing of originals, optics, and patterned surfaces for opto-mechanical processing. Effect
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[0022] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0023] figure 1 Shown is a method for marking special processing graphics in optical proximity correction in an embodiment, including the following steps.
[0024] S110, acquiring a semiconductor layout and a marking layer.
[0025] In the semiconductor layout, when there is a region that needs to be specially designed, in order to realize the optical proximity correction (OPC), the region is specially treated, and the special region is often marked by adding a marking layer. Due to different requirements of different customers, the marking layer is generally provided by customers. However, the...
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Abstract
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