Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling

A multi-physics field and connection method technology, applied in the field of material connection, can solve the problems of weld cracks, pores, glass brittleness, and insufficient mechanical properties of welded joints, etc., to eliminate weld defects, improve weld toughness, Effect of Reducing Residual Thermal Stress

Inactive Publication Date: 2016-01-13
TIANJIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problems are: when there is only a temperature field and no reinforcing phase in the amorphous solder, the weld is pro

Method used

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  • Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling
  • Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are as follows:

[0023] 1) Cleaning of ceramic surface to be welded

[0024] Remove grease and stains from the surfaces of alumina ceramic sheets and silicon carbide ceramic sheets to be welded, pre-treat them with mechanical grinding, remove the oxide film initially, and then clean them with an ultrasonic cleaner;

[0025] 2) Preparation of solder

[0026] The solder is a mixed material of glass powder and silicon carbide whiskers, wherein the volume percentage of silicon carbide whiskers is 30%, and the mixed material of glass powder and silicon carbide whiskers is put into a ball mill and mixed evenly to make powdery solder;

[0027] 3) ceramic / ceramic connection

[0028] Place the composite solder prepared above b...

Embodiment 2

[0032] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are basically the same as in Example 1, the difference is: The base materials are alumina ceramic sheets and silicon nitride ceramic sheets.

[0033] The histograms without ultrasonic application and with ultrasonic application are similar to Example 1.

Embodiment 3

[0035] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are basically the same as in Example 1, the difference is: in the aluminum oxide In the mixed material solder used between the ceramic sheet and the silicon carbide ceramic sheet, the reinforcement phase silicon carbide is in the form of particles.

[0036] The histograms without ultrasonic application and with ultrasonic application are similar to Example 1.

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Abstract

Provided is a ceramic/ceramic connection method for regulating and controlling a middle solder layer through multi-physical-field coupling. According to the ceramic/ceramic connection method, a heat source is adopted to fuse solder or solder and a part of base metal, meanwhile physical fields are additionally applied, the solder is a non-crystalline material or a mixed material of the non-crystalline material and a reinforcement phase, an outer heating source is acetylene flame or oxyhydrogen flame, electric arcs, laser, electron beams or a resistance heating method for melting metal through heat conduction and heat radiation is adopted, and the additionally-applied physical fields are one or more than two of ultrasonic waves, magnetic fields and electric fields which are simultaneously applied. The ceramic/ceramic connection method has the advantages of effectively controlling interface reaction, strengthening liquid metal flowing, regulating and controlling weld joint substance distribution, regulating the metallurgical welding process, controlling a weld joint organization structure, eliminating weld joint defects, reducing residual waste heat stress, improving weld joint toughness, promoting interface bonding, improving the mechanical property of welded joints, decreasing the material using amount and reducing environmental pollution through the additionally-applied physical fields and being widely applied to the fields of aviation, aerospace, electronic devices, fuel cells and the like.

Description

technical field [0001] The invention belongs to the technical field of material connection, in particular to a ceramic / ceramic connection method for multi-physical field coupling regulation and control of an intermediate solder layer. Background technique [0002] Material welding and joining technology is a material forming method that realizes firm metallurgical bonding of the same or different materials with different physical, chemical and mechanical properties. The base metal still maintains its original characteristics, which is superior to using a single metal. The welding and connection of materials are generally valued. Structural materials include special ceramics, metals and their composite materials, etc. Ceramic / ceramic welding and connection are widely used in aviation, aerospace, electronic packaging, fuel cell assembly, etc. [0003] Ceramic / ceramic welding and connection methods mainly include mechanical connection method, bonding method, surface activation...

Claims

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Application Information

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IPC IPC(8): C04B37/00
Inventor 王谦朱琳周小玉李云涛王志华何先迪宋丽新郭大伟万朝辉
Owner TIANJIN UNIVERSITY OF TECHNOLOGY
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