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A ceramic/ceramic connection method for intermediary solder layer controlled by multi-physics coupling

A multi-physics and connection method technology, applied in the field of material connection, can solve the problems of cracks, pores, insufficient mechanical properties of welded joints, and large glass brittleness in welds, so as to eliminate weld defects, reduce residual thermal stress, The effect of improving the toughness of the weld

Inactive Publication Date: 2017-06-20
TIANJIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problems are: when there is only a temperature field and no reinforcing phase in the amorphous solder, the weld is prone to defects such as cracks and pores, the glass is brittle, and the mechanical properties of the welded joint are insufficient

Method used

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  • A ceramic/ceramic connection method for intermediary solder layer controlled by multi-physics coupling
  • A ceramic/ceramic connection method for intermediary solder layer controlled by multi-physics coupling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are as follows:

[0023] 1) Cleaning of ceramic surface to be welded

[0024] Remove grease and stains from the surfaces of alumina ceramic sheets and silicon carbide ceramic sheets to be welded, pre-treat them with mechanical grinding, remove the oxide film initially, and then clean them with an ultrasonic cleaner;

[0025] 2) Preparation of solder

[0026] The solder is a mixed material of glass powder and silicon carbide whiskers, wherein the volume percentage of silicon carbide whiskers is 30%, and the mixed material of glass powder and silicon carbide whiskers is put into a ball mill and mixed evenly to make powdery solder;

[0027] 3) ceramic / ceramic connection

[0028] Place the composite solder prepared above b...

Embodiment 2

[0032] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are basically the same as in Example 1, the difference is: The base materials are alumina ceramic sheets and silicon nitride ceramic sheets.

[0033] The histograms without ultrasonic application and with ultrasonic application are similar to Example 1.

Embodiment 3

[0035] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are basically the same as in Example 1, the difference is: in the aluminum oxide In the mixed material solder used between the ceramic sheet and the silicon carbide ceramic sheet, the reinforcing phase silicon carbide is in the form of particles.

[0036] The histograms without ultrasonic application and with ultrasonic application are similar to Example 1.

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Abstract

A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the solder is an amorphous material or a mixed material of an amorphous material and a reinforcing phase, plus The heat source is acetylene flame or oxyhydrogen flame, electric arc, laser, electron beam or resistance heating method for melting metal through heat conduction and heat radiation, and the additional applied physical field is one or more of ultrasonic wave, magnetic field and electric field at the same time apply. The advantages of the present invention are: the welding method effectively controls the interface reaction and strengthens the flow of liquid metal through the additional physical field, regulates the distribution of weld materials, adjusts the welding metallurgical process, controls the structure of the weld, eliminates weld defects, and reduces residual Thermal stress, improve weld toughness, promote interface bonding, improve the mechanical properties of welded joints, reduce the use of materials and reduce environmental pollution, widely used in aviation, aerospace, electronic devices, fuel cells and other fields.

Description

technical field [0001] The invention belongs to the technical field of material connection, in particular to a ceramic / ceramic connection method for multi-physical field coupling regulation and control of an intermediate solder layer. Background technique [0002] Material welding and joining technology is a material forming method that realizes firm metallurgical bonding of the same or different materials with different physical, chemical and mechanical properties. The base metal still maintains its original characteristics, which is superior to using a single metal. The welding and connection of materials are generally valued. Structural materials include special ceramics, metals and their composite materials, etc. Ceramic / ceramic welding and connection are widely used in aviation, aerospace, electronic packaging, fuel cell assembly, etc. [0003] Ceramic / ceramic welding and connection methods mainly include mechanical connection method, bonding method, surface activation...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/00
Inventor 王谦朱琳周小玉李云涛王志华何先迪宋丽新郭大伟万朝辉
Owner TIANJIN UNIVERSITY OF TECHNOLOGY
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