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Support chuck and apparatus for treating substrate

A technology for processing equipment and supporting substrates, applied in optics, instruments, electrical components, etc., can solve problems such as difficult maintenance of devices, difficulty in maintaining the sealed state inside the chamber, and achieve the effect of preventing twisting

Inactive Publication Date: 2016-01-13
AP SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, the device according to the prior art is implemented in a complicated structure to mechanically drive a plurality of ejector pins, and thus it may be difficult to maintain a sealed state inside the chamber, and maintenance of the device may be difficult

Method used

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  • Support chuck and apparatus for treating substrate
  • Support chuck and apparatus for treating substrate
  • Support chuck and apparatus for treating substrate

Examples

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Embodiment Construction

[0041] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawing figures, the dimensions of layers and regions are exaggerated for clarity of illustration. Like reference numbers refer to like elements throughout.

[0042] figure 1 is a side view of a substrate processing apparatus according to an embodiment, and figure 2 is a side view of a support chuck according to one embodiment. And, FIG. 3(a) and FIG. 3(b) are partial views of a support chuck according to a modified example, and Figures 4 to 8 is a view illustrating a state in which a substrate processing apparatus operates according to an embodiment. ...

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Abstract

The invention provides a support chuck and apparatus for treating substrate. The support chuck for treating substrate comprises: a main body which is provided with an inner space; an extendible component which is configured to divide the inner space in the thickness direction of the main body, the extendible component is arranged inside the main body so that it can move in the thickness direction of the main body through the gas injected to the seperated space; a moving component which passes through a surface of a main body in the thickness direction of the main body and is arranged on a flexible component; and an adhesive component which is arranged on an end part of the moving component of the main body. By use of the support chuck, the case of wringing of a substrate is prevented while the substrate is detached from a supporting unit.

Description

technical field [0001] The present invention relates to a support chuck and a substrate processing apparatus, and more particularly, to a support chuck capable of preventing twisting of a substrate when the substrate is separated from a unit for supporting the substrate, and having the A substrate processing apparatus supporting a chuck is described. Background technique [0002] Generally, a flat panel display device such as a liquid crystal display (LCD) and an organic light emitting device (OLED) are manufactured by bonding a pair of flat panel substrates to each other. For example, an upper substrate on which a plurality of thin film transistors are located, an organic light emitting layer, and electrodes are arranged to be bonded to a lower substrate serving as a capping layer to fabricate an OLED. Here, the means for bonding the above-mentioned substrates are realized in various shapes. For example, a "substrate bonding apparatus" is disclosed in Korean Patent Regist...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67H01L21/683G02F1/1303G02F1/1309G02F2201/54H01L21/67309
Inventor 金相午
Owner AP SYST INC