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A high thermal density and high power solid-state transmitter module cooling device

A technology for transmitting modules and cooling devices, which is applied in the field of devices responsible for heat dissipation and temperature control in solid-state transmitting modules, and can solve the problems of increasing the volume and weight of interference equipment

Active Publication Date: 2018-08-31
CNGC INST NO 206 OF CHINA ARMS IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since both the millimeter-wave transmitting module and the centimeter-wave transmitting module are devices with high heat flux density and high heat dissipation power, a large heat dissipation device is required. If a heat dissipation device is designed for each module, the volume and weight of the interference device will be increased.

Method used

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  • A high thermal density and high power solid-state transmitter module cooling device
  • A high thermal density and high power solid-state transmitter module cooling device
  • A high thermal density and high power solid-state transmitter module cooling device

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Embodiment Construction

[0027] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0028] The principle and structure of high heat density and high power module cooling device:

[0029] The device mainly consists of (such as image 3 , 4 Shown) left fan cover 11, cooling plate A12, cooling plate B13, bottom cover and support 14, right fan cover 15, upper cover 16 etc. are formed. Where heat sink A (such as figure 1 shown) is composed of the first cooling gear group 1, the first heat pipe group 2, the first support plate 3, the first heat sink plate 4, the first heat conduction plate 5, etc., and the cooling plate B (such as figure 2 (shown) is composed of the second heat conducting plate 6, the second heat pipe group 7, the second support plate 8, the second heat sink plate 9 and the second heat dissipation tooth group 10, etc. The first heat sink plate 4 in the heat dissipation plate A12 is made of high thermal conductivity material pure ...

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Abstract

The invention relates to a high-heat-density high-power solid-state emission module radiating device. According to the radiating device, heat sink plates with high thermal conductivity are used to disperse the heat density, then, the heat is transferred to a radiator and an air duct by a heat pipe, and finally, the heat is discharged by a high-power fan. Modules in different bands are installed on different radiating plates, a common air duct is formed at the radiating teeth, the heat of the radiating teeth is conducted, and therefore, the radiating efficiency of the radiator when the modules work in a time-sharing mode is increased. Temperature control plates are added in the corresponding portions of the heat sink plates to realize thermal production during work of the modules.

Description

technical field [0001] The invention is applied in the technical field of radar electronic countermeasures. It is a device responsible for heat dissipation and temperature control in a solid-state transmitting module. The problem of sharing the cooling device when working. Background technique [0002] With the development of radar solid-state technology, the development of solid-state power devices presents the following characteristics: higher power, higher packaging density, smaller dimensions, and higher heat flux. Most of the power modules used in electronic countermeasures work in a large duty cycle or even in continuous wave mode, and the heat density and heat are greater than those used in ordinary radars. The work of power devices has its upper temperature limit, and it will malfunction or fail when it is overheated. This increases the difficulty of heat dissipation system design. [0003] The millimeter wave transmitter module and the centimeter wave transmitter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 白云飞陈蜻陈卓王克军余建宇
Owner CNGC INST NO 206 OF CHINA ARMS IND GRP
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