Sensor device and encoder

A sensor device and encoder technology, applied in the direction of the casing of the measuring device, can solve problems such as cost increase and foreign matter movement, and achieve the effect of preventing or suppressing circuit short circuit and preventing conductive foreign matter from adhering to electronic components and circuit boards.

Active Publication Date: 2016-02-03
SANKYO SEIKI MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the technique of covering the circuit board with resin, there is a problem that the cost of manufacturing the device on which the circuit board is mounted increases.
[0007] On the other hand, in the technique of covering a circuit board with a cover member, conductive foreign matter adhering to the surface of the circuit board before covering the circuit board with the cover member may move between the cover member and the circuit board over time.
For example, in the circuit board of a magnetic sensor device (magnetic encoder) equipped with a sensor that detects the displacement of a magnet attached to a rotating body, the magnetic field changes due to the displacement of the magnet, which may cause Foreign objects made of magnetic materials move

Method used

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Examples

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Embodiment Construction

[0052] Hereinafter, as an embodiment to which the present invention is applied, a magnetic rotary encoder mounted on a motor will be described with reference to the drawings.

[0053] (the whole frame)

[0054] Figure 1(a) to Figure 1(c)It is an explanatory diagram of a motor unit equipped with a rotary encoder to which the present invention is applied. Fig. 1(a) is a perspective view of the motor unit viewed from the output side protruding from the output shaft, Fig. 1(b) is a perspective view of the motor unit viewed from the opposite output side opposite to the output side, and Fig. 1(c) is viewed from the output side A perspective view of a state in which the encoder case and the cover member are removed from the motor unit when viewed from the opposite side. figure 2 It is a sectional view of the rotary encoder installed in the motor unit.

[0055] The motor unit 1 has: a unit main body 2 having a rectangular parallelepiped shape as a whole; and an output shaft 3 prot...

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PUM

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Abstract

The present invention provides a sensor device and an encoder. The sensor device is able to restrain the movement of a conductive foreign matter attached to the surface of a circuit board and protect the surface of the circuit board in a simple structure. A magnetic sensor device (11) (the sensor device) has a circuit board equipped with an electronic element (25) and a dustproof part (18) capable of elastic deformation. The dustproof part coats the surface (16a) of the circuit board by pressing the electronic element and the circuit board. In the condition of the conductive foreign matter attached to the surface of the circuit board, the conductive foreign matter is clamped between the dustproof part and the circuit board or between the dustproof part and the electronic element so as to restrain the movement of the conductive foreign matter. After the circuit board is coated with the dustproof part, the conductive foreign matter is prevented from attaching to the electronic element and the circuit board. Thus, the short circuit of the circuit caused by a conductive foreign matter may be avoided or restrained.

Description

technical field [0001] The invention relates to a sensor device comprising a circuit board and an encoder. Background technique [0002] When foreign matter such as conductive dust adheres to the surface of a circuit board on which electronic components are mounted, a circuit formed on the circuit board may be short-circuited. [0003] Patent Documents 1 and 2 describe techniques capable of preventing foreign matter from adhering to the surface of a wiring board. In Patent Document 1, the surface of the circuit board is covered with resin. In Patent Document 2, the surface of the circuit board is covered with an air permeable cover member. [0004] Patent Document 1: Japanese Patent Application Laid-Open No. H10-41680 [0005] Patent Document 2: Japanese Patent Laid-Open No. 2003-133703 [0006] In order to cover the surface of the circuit board with resin, it is necessary to perform an operation process of laminating the resin layer on the circuit board in the process o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D11/24
Inventor 斋藤豊
Owner SANKYO SEIKI MFG CO LTD
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