Laser device and method for leveling harmonic oscillators of axisymmetric structures
A technology of laser equipment and harmonic oscillators, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of extremely high axisymmetric performance requirements, difficulty in meeting the performance requirements of harmonic oscillators, and manual errors
Active Publication Date: 2017-01-25
SHANGHAI XINYUE METER FACTORY
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Problems solved by technology
[0002] The existing axisymmetric structures of resonators and gyroscopes have extremely high requirements on the axisymmetric performance of the core resonators, and it is difficult for general mechanical processing methods to meet the performance requirements of the resonators; therefore, it is necessary to follow up the resonators obtained by machining. The finishing process removes excess mass and makes the harmonic oscillator level
[0003] At present, for the above-mentioned finishing process, the main method is manual repeated measurement, calculation, and weight removal. This method has many shortcomings: 1. It is difficult to accurately obtain the main axis of the harmonic oscillator; 2. The gyroscope needs to be disassembled and assembled continuously. , it is difficult to ensure the consistency and repeatability of the measurement axis; 3. Calculation deviation and manual error are prone to occur
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[0028] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.
[0029] Such as figure 1 As shown, a laser device for leveling an axisymmetric structure harmonic oscillator, which includes: an excitation probe 2, used to make the harmonic oscillator 1 generate a resonant response; a laser vibrometer 3, used to obtain the vibration of the harmonic oscillator 1 Resonant frequency; rotating unit 5, the resonant oscillator 1 is fixed on the rotating unit, and it is in the same vertical plane as the excitation probe 2 and the laser vibrometer 3; the processing control unit 6 is connected to the excitation probe respectively 2. The laser vibrometer 3 and the rotation unit 5, which calculate the vibration frequency data transmitted by the laser vibrometer 3 and the rotation angle information of the rotation unit 5 and obtain the points on the resonator 1 that need to be removed; the ...
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The invention discloses laser equipment for leveling a harmonic oscillator with an axisymmetric structure. The laser equipment comprises an excitation probe, a laser vibration measuring instrument, a rotating unit and a processing control unit, wherein the excitation probe is used for enabling the harmonic oscillator to generate resonant response; the laser vibration measuring instrument is used for acquiring resonant frequency of the harmonic oscillator; the harmonic oscillator is fixed on the rotating unit and is located in the same vertical plane with the excitation probe and the laser vibration measuring instrument; the processing control unit is connected with the excitation probe, the laser vibration measuring instrument and the rotating unit and is used for calculating vibrational frequency data transmitted by the laser vibration measuring instrument and rotating angle information of the rotating unit and acquiring points requiring mass removal on the harmonic oscillator. The laser equipment has the advantages that a principal axis and frequency difference of the harmonic oscillator with the axisymmetric structure can be automatically and accurately measured once, and meanwhile, mass leveling can be performed on the harmonic oscillator with the axisymmetric structure.
Description
technical field [0001] The invention relates to the technical field of sensor finishing, in particular to a laser device for leveling a harmonic oscillator of an axisymmetric structure. Background technique [0002] The existing axisymmetric structures of resonators and gyroscopes have extremely high requirements on the axisymmetric performance of the core resonators, and it is difficult for general mechanical processing methods to meet the performance requirements of the resonators; therefore, it is necessary to follow up the resonators obtained by machining. The finishing treatment removes excess mass and makes the harmonic oscillator level. [0003] At present, for the above-mentioned finishing process, the main method is manual repeated measurement, calculation, and weight removal. This method has many shortcomings: 1. It is difficult to accurately obtain the main axis of the harmonic oscillator; 2. The gyroscope needs to be disassembled and assembled continuously. , it...
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IPC IPC(8): B23K26/351
CPCB23K26/361
Inventor 赵万良成宇翔李绍良钱诚蔡伟明蔡雄
Owner SHANGHAI XINYUE METER FACTORY