Lead-free solder alloy
A lead-free solder alloy and solder joint technology, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve the problem of not giving the joint strength and so on
Inactive Publication Date: 2016-02-17
NIHON SUPERIOR CO LTD
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[0016] However, the techniques disclosed in Patent Documents 1 to 5 do not give any suggestion about the joint strength exposed to high temperature for a long time.
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[0041] Next, the present invention will be described in detail.
[0042] Conventionally, in solder bonding of electronic devices and the like, bonding strength during solder bonding has been cited as an important item, and solder alloys having improved bonding strength during solder bonding have been developed and provided.
[0043] However, in the use of electronic equipment, the solder joints used in electronic equipment and the like are particularly likely to be in a state of flowing current or exposed to high temperatures, and the temperature rise of the solder joints may be accelerated due to the external environment. Therefore, in order to improve the reliability of the solder joint, it is necessary to suppress the temporal deterioration of the solder joint in a high temperature state.
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Abstract
The purpose of the present invention is to provide a lead-free solder alloy and solder in which it is possible to maintain high junction strength that does not decrease even in a high temperature state after soldering, the lead-free solder alloy and solder having a high degree of reliability and versatility. In the present invention, the basis composition is Sn-Cu-Ni, the lead-free alloy composition containing 0.1-2.0 mass% of Cu, 0.01-0.5 mass% of Ni, 0.1-5 mass% of Bi, and 76.0-99.5 mass% of Sn. As a result of such a lead-free alloy composition, the junction strength of the solder does not decrease during soldering even when the solder is exposed to high temperatures over a long period of time, as shall be apparent, thereby enabling highly reliable soldering.
Description
technical field [0001] The present invention relates to a lead-free solder alloy that has little degradation over time and has good long-term reliability, and a joint using the solder alloy. Background technique [0002] In order to reduce the impact on the global environment, lead-free solders are widely used as bonding materials for electronic products, and Sn-Ag-Cu-based solder alloys and Sn-Cu-Ni-based solder alloys are typical components thereof. [0003] In recent years, in addition to Sn-Ag-Cu-based solder alloys and Sn-Cu-Ni-based solder alloys, joining applications with lead-free solder alloys added with Bi, In, or Sb, and Sn-Zn-based solder alloys have been proposed and characteristics correspond to lead-free solder alloys. [0004] In particular, lead-free solder alloys containing Bi, Sb, or In are disclosed for the purpose of improving the mechanical strength of joints and lowering the solidus temperature. [0005] For example, Patent Document 1 discloses a lea...
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IPC IPC(8): B23K35/26C22C13/00C22C13/02B23K1/00
CPCB23K35/26C22C13/00C22C13/02B23K35/3613B23K35/362B23K35/0244B23K35/025B23K1/0016B23K35/262H01R4/02
Inventor 西村哲郎西村贵利
Owner NIHON SUPERIOR CO LTD