Bi group solder alloy, method for bonding electronic part using same, and electronic part mounting substrate
A technology for electronic components and bonding methods, which is applied in the direction of assembling printed circuits, printed circuit components, and electrical components with electrical components, which can solve the problem that the solidus temperature is less than 265 ° C, the wetting ductility is reduced, and the wetting ductility is low. and other problems, to achieve the effect of no change in chip characteristics, improved mechanical strength, and high bonding reliability.
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Embodiment 1-11
[0144] (1) Manufacture of solder alloys (solder preforms) for Ag-plated electronic components
[0145] First, Bi, Ag, Al, Te, Cu, Ni (purity of each element: 99.99% by weight or more) were prepared as raw materials. Spherical granular raw materials with a diameter of φ3mm or less are used as raw materials. When the raw materials are large flakes or lumps, the raw materials are cut while paying attention to making the molten alloy uniform without composition deviation due to the sampling location. Grinding, etc., to refine it to a size of 3mm or less. Next, a predetermined amount was weighed from these raw materials and put into a graphite crucible for a high-frequency melting furnace.
[0146] Next, the crucible containing the raw material was placed in a high-frequency melting furnace, and nitrogen gas was flowed at a flow rate of 0.7 L / min or more per 1 kg of raw material in order to suppress oxidation. In this state, the inside of the melting furnace was heated to 500° C....
Embodiment 12-24
[0168] (1) Manufacture of solder alloys (solder preforms) for bare Cu electronic components
[0169] A linear solder preform was produced in the same manner as in Examples 1-11 above, except that Bi, Ag, Al, P, Ge, Cu (purity of each element: 99.99% by weight or more) were used as raw materials. In all embodiments, it can be processed and wound into a wire shape.
[0170] (2) Physical properties and performance tests
[0171] Using the linear solder preform sample obtained by the above method, the measurement of the solidus temperature and the liquidus temperature, and the observation and measurement of the particle diameter containing the Ag-Al intermetallic compound were carried out. After that, the solder preform samples were chip-bonded to a lead frame made of Cu to evaluate the wettability, and after molding with epoxy resin, a temperature cycle test and a reflow test were performed to evaluate the bonding reliability. The results are shown in Table 2.
Embodiment 25-37
[0187] (1) Manufacture of solder alloys (solder preforms) for Ni-plated electronic components
[0188] A linear solder preform was produced in the same manner as in Examples 1-11 above, except that Bi, Ag, Al, Sn, Zn, P, Ge, Cu (purity of each element: 99.99% by weight or more) were used. as raw material. In all embodiments, it can be processed and wound into a wire form.
[0189] (2) Physical properties and performance tests
[0190] Using the linear solder preform sample obtained by the above method, the measurement of the solidus temperature and the liquidus temperature, and the observation and measurement of the diameter of the particles containing the AgAl intermetallic compound were carried out.
[0191] Furthermore, solder preform samples were die-bonded to a Ni-plated lead frame to evaluate wettability, and after molding with epoxy resin, a cycle test was performed to evaluate bonding reliability. The results are shown in Table 3.
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Abstract
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