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Two-component epoxy resin pouring sealant and preparation method thereof

An epoxy resin, two-component technology, used in the field of potting glue, can solve the problems of poor mechanical properties, toughness, limited application scope, general mechanical properties, etc., to avoid destructive cracking, reduce the number of hydroxyl groups, and absorb strong ultraviolet rays. effect of ability

Inactive Publication Date: 2016-03-02
SUZHOU GAIDE FINE MATERIALS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The problem with the two-component epoxy resin potting compound is that its mechanical properties are relatively general, especially its toughness is relatively poor, which limits its application range
The potting compound has low viscosity, good flame retardant effect, strong adhesion and good moisture-proof performance after curing, and can be used for more than 4 hours. However, the potting compound also has poor mechanical properties and toughness. good question

Method used

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  • Two-component epoxy resin pouring sealant and preparation method thereof

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Abstract

The invention provides a two-component epoxy resin pouring sealant. The two-component epoxy resin pouring sealant is composed of a component A and a component B, wherein, the component A comprises the following raw materials in parts by weight: 100 parts of epoxy resin, 10-15 parts of diluents, 1-3 parts of an antifoaming agent, 50-70 parts of a filler, 5-8 parts of a fire retardant, 1-1.5 parts of color paste, 20-30 parts of nano iron oxide, and 10-15 parts of LIR; the component B comprises the following raw materials in parts by weight: 100 parts of a curing agent and 2-4 parts of a promoter; wherein a weight ratio of the component A to the component B is 2:1. The invention also provides a preparation method of the two-component epoxy resin pouring sealant. The two-component epoxy resin pouring sealant has the advantages of good mechanical property and strong toughness.

Description

Technical field: The invention relates to a potting glue, in particular to a two-component epoxy resin potting glue and a preparation method thereof. Background technique: Potting glue, English name Pottingofsmidahk, also known as electronic glue, is a broad term, mainly used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before curing and has fluidity. The viscosity of the glue varies according to the material, performance, and production process of the product. The potting glue can only realize its use value after curing. Play the role of waterproof, moisture-proof, dust-proof, insulation, thermal conductivity, confidentiality, corrosion resistance, temperature resistance and shock resistance. There are many types of electronic potting glue. From the type of material, there are currently three most commonly used, namely epoxy resin potting glue, silicone resin potting glue, and polyurethane potting glue. Material p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J109/00C09J11/08C09J11/04
Inventor 李晓明
Owner SUZHOU GAIDE FINE MATERIALS CO LTD
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