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Structural Pu adhesive for composite bonding

A technology of adhesives, compositions, applied in the direction of adhesive types, polyurea/polyurethane adhesives, adhesives, etc.

Active Publication Date: 2016-03-02
DDP SPECIALTY ELECTRONICS MATERIALS US LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy-based adhesives require relatively high oven temperatures for the resin to cure

Method used

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  • Structural Pu adhesive for composite bonding
  • Structural Pu adhesive for composite bonding
  • Structural Pu adhesive for composite bonding

Examples

Experimental program
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example

[0012] The invention can be further illustrated by the following non-limiting examples.

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Abstract

A new polyurethane (PU) adhesive composition having unique properties in automotive related applications such as composite bonding is provided.

Description

technical field [0001] The present invention relates to a novel polyurethane (PU) adhesive composition with unique properties in automotive related applications such as composite bonding. Background technique [0002] Structural composite bonding of automotive parts or entire modules typically requires immediate bond strength after assembly with high modulus (about 100 to 300 MPa) and relatively high elongation at break (100% to 200%). Simple application using a one-component (1K) composition is desired for ease of handling. Also needed is adhesion of the composition to carbon fiber reinforced polymer (CFRP) or sheet molding compound (SMC) parts without activation and with flexibility within open time (part assembly after adhesive application) . Currently commercially available two-component (2K) PU adhesive compositions often require complex application systems and complex processing steps. It also exhibits limited flexibility in open time. However, epoxy-based adhesive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/79C08G18/08C08G18/50C08G18/22C08G18/32
CPCC08G18/5024C08G18/798C08G18/0885C08G18/227C08G18/3215C08G18/3228C08G18/675C09J175/08
Inventor A·卢茨D·施耐德S·施马特洛赫I·卡德尔斯
Owner DDP SPECIALTY ELECTRONICS MATERIALS US LLC