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A thermally conductive electronic material composition

A technology of electronic materials and compositions, which is applied in the field of thermally conductive electronic material compositions, can solve problems such as poor compatibility and decreased mechanical properties of materials, and achieve good compatibility, meet the needs of development and application, and increase the number of microcrack points

Active Publication Date: 2019-02-22
WUJIANG XINTA FORWARD HARDWARE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, graphite powder has poor compatibility with organic materials, and its use in organic modification often leads to defects such as a decrease in the mechanical properties of the material.

Method used

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  • A thermally conductive electronic material composition
  • A thermally conductive electronic material composition
  • A thermally conductive electronic material composition

Examples

Experimental program
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Effect test

Embodiment

[0018] According to the composition in Table 1, sodium triacetate was dissolved in ether to prepare sodium triacetate ether solution; N,N'-carbonyldiimidazole was added to ethanol to prepare N,N'-carbonyldiimidazole ethanol solution; alicyclic epoxy Mix the resin with acrolein, then add tri-n-butylamine, and stir at 100°C for 30 minutes; then add indoline-2,3-dione, and continue stirring for 30 minutes; Stir for 30 minutes; then add filler and continue stirring for 1 hour; finally add 2,6-bis(4-aminophenoxy)benzonitrile; adjust the temperature to 90°C and stir for 45 minutes; adjust the temperature to 50°C and add in sequence Sodium triacetate ether solution and N,N'-carbonyldiimidazole ethanol solution are stirred evenly, and the solvent is removed by rotary evaporation to obtain a thermally conductive electronic material composition.

[0019] Table 1 Composition of each raw material / g

[0020] Example

[0021] First, 1Kg of graphite powder, 300g of ytterbium fluor...

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Abstract

The invention relates to a heat-conducting electronic material composition which is obtained by mixing N,N'-carbonyldimidazole, tetra-functional epoxy resin, tri-n-butylamine, indoline-2,3-diketone, 2,6-di(4-aminophenoxy) cyanobenzene, a filler, cycloaliphatic epoxide resin, sodium triacetate and acraldehyde. Raw materials in a preparation method disclosed by the invention are wide in source, and the preparation process is simple and controllable, only needs normal operation and is easy to realize industrialization, therefore, the prepared heat-conducting electronic material composition has good heat conductivity and mechanical properties, and development applications of the heat-conducting electronic material composition can be met.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a heat-conducting electronic material composition. Background technique [0002] Composite materials are important basic materials for high-tech fields such as information technology, biotechnology, and energy technology, as well as for national defense construction. At the same time, they also play a very important role in transforming traditional industries such as agriculture, chemicals, and building materials. Since the beginning of the 21st century, the global composite material market has grown rapidly, especially in Asia, especially in China. From 2003 to 2008, China's average annual growth rate was 15%, India's was 9.5%, while Europe and North America's average annual growth rate was only 4%. There are many kinds of composite materials and they are widely used. Among them, electronic composite materials are forming a large-scale high-tech industr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/06C08K3/04C08K3/16C08K3/22C08K3/32C08K5/3417C08K5/07C08K5/315
CPCC08L63/00C08L2205/025C08K13/06C08K3/04C08K3/16C08K2003/2241C08K2003/327C08K5/3417C08K5/07C08K5/315
Inventor 杨和荣
Owner WUJIANG XINTA FORWARD HARDWARE FACTORY
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