34results about How to "Meet the development application" patented technology

The invention relates to a biological enrichment method of a conjugated linolenic acid isomer. The biological enrichment method comprises biological enrichment culture medium preparation, production strain preparation, biological enrichment of the conjugated linolenic acid isomer, and other steps to obtain the c9,t11,c15-conjugated linolenic acid isomer. According to the present invention, the c9,t11,c15-conjugated linolenic acid isomer mass content in the obtained product is more than 0.36%, and the substrate conversion rate is more than 90%; and with the biological enrichment culture, the c9,t11,c15-conjugated linolenic acid isomer-rich anti-cancer function product is obtained, proteins and cellulose in defatted soybean can be decomposed into polypeptides, soluble dietary fibers and other active factors having health functions through lactic acid bacteria, and the health function of the product is significantly enhanced so as to further broaden the application range of the product.

The invention relates to a preparation method for a flame-retardant heat-resistant antenna radome base material. The preparation method comprises the following steps: preparing a filler with the average grain size of 180 nanometers by taking nano silicon dioxide foam, dodecylbenzene sulfonic acid, bismuth nitrate pentahydrate and methyl trichlorosilane as raw materials; preparing a resin prepolymer by taking DOPO, a bisphenol A cyanate ester monomer, a phenolic compound, 1,3,5-triglycidyl -S-triazinetrione, bisphenol A epoxy resin and diaminodiphenyl ether as raw materials; mixing the resin prepolymer with maleic anhydride; then sequentially adding poly(methylsilsesquioxane) and the filler; then adding isomeric undecanol polyoxyethylene ether phosphate potassium salt and glass beads to obtain a composite system; then injecting the composite system into a die coated with a release agent, carrying out mold pressing under a vacuum condition, and finally turning off a power supply and naturally cooling; and releasing the die to obtain the flame-retardant heat-resistant antenna radome base material. The flame-retardant heat-resistant antenna radome base material has excellent flame retardance and heat resistance, and the development application of the flame-retardant heat-resistant antenna radome base material is satisfied.

The invention relates to a heat-conducting electronic material composition which is obtained by mixing N,N'-carbonyldimidazole, tetra-functional epoxy resin, tri-n-butylamine, indoline-2,3-diketone, 2,6-di(4-aminophenoxy) cyanobenzene, a filler, cycloaliphatic epoxide resin, sodium triacetate and acraldehyde. Raw materials in a preparation method disclosed by the invention are wide in source, and the preparation process is simple and controllable, only needs normal operation and is easy to realize industrialization, therefore, the prepared heat-conducting electronic material composition has good heat conductivity and mechanical properties, and development applications of the heat-conducting electronic material composition can be met.

The invention relates to an electronic material and a preparation method thereof. The preparation method comprises the following steps: mesoporous silica is modified firstly, then epoxy with monofunctional groups and epoxy with bifunctional groups are prepared, and a glue solution is obtained by mixing; the glue solution, a reinforcing material and metal foil are subjected to hot-press molding, and the electronic material can be obtained. The electronic material has the excellent flame retardance and heat resistance, and requirements for development and application of the electronic material are met.

The invention relates to a novel luminescent composite material. EuCl3 and trimethylsilanolate silicate ester are mixed for 2 hours to obtain a mixture; thioacetamide and ceramic powder are sequentially added into the mixture; the materials are stirred for 4 hours; then, palmitic acid and n-butyllithium are added; the materials are stirred for 2 hours at 80 DEG C; next, cyanoethyl chitosan and grapheme are added, and are stirred for 1 hour at 120 DEG C; finally, acrylic ester- styrol copolymers and N-formyl morpholine are added; the materials are stirred for 4 hours at 130 DEG C to obtain luminescent compounds; then, the luminescent components are added into a mold and is subjected to molding pressing to obtain the novel luminescent composite material. A preparing method disclosed by the invention has the advantages that the raw material resources are wide, the preparing process is simple and controllable, only conventional operation is needed, and the industrialization is easily realized.

The invention relates to a preparation method of a novel composite solid gum. The preparation method comprises the following steps: mixing a filling material, ethylene glycol monobutyl ether, and silica sol for one hour to obtain a mixture; then adding sodium metaborate, a dispersant, and succinic anhydride into the mixture in sequence, stirring for 0.5 hour, then adding epoxy resin prepolymer, stirring for 3 hours at a temperature of 140 DEG C; finally adding polyvinylpyrrolidone and zinc chloride hydrate, stirring for 8 hours at a temperature of 60 DEG C to obtain a compound; then filling the compound into a mould, and cold-pressing the compound to obtain the composite solid gum. The disclosed preparation method has the advantages that the raw material resources are wide, the preparation process is simple and controllable, only normal operation is needed, and the preparation method can be easily applied to industrialization.

The invention relates to a fold-resistant composite material. Cobalt phthalocyanine, stearic acid and polyether diol are evenly mixed to be reacted at the temperature of 85 DEG C for two hours to obtain a mixture; 1,3-bis(isocyanatomethyl)-cyclohexan, thioacetamide, bisphenol A dianhydride and polyoxyethylene rosin ester are sequentially added into the mixture to be stirred at the temperature of 110 DEG C for four hours, then phenylcyclohexane and hydroxylamine potassium are added to be stirred at the temperature of 120 DEG C for one hour; at last, polyimide resin, phenoxy resin and tetrazole are added to be stirred at the temperature of 120 DEG C for half an hour, and accordingly a fold-resistant prefabricated object is obtained; then the fold-resistant prefabricated object is placed in a mold, and the fold-resistant composite material is obtained through hot pressing. The fold-resistant composite material has excellent mechanical property and heat resistance, and the application and development requirements of the fold-resistant composite material can be met.

The invention relates to a low-dielectric-loss casting body which is prepared by the following steps: preparing a resin-base composite system from a bismaleimide resin monomer, maleic anhydride, octamethylcyclotetrasiloxane, pentaerythritol tetraacrylate, a phenoxy oxygen resin, isomerized tridecyl alcohol polyethenoxy ether, a polycaprolactam resin, a filler and ethylene glycol; and adding the resin-base composite system into a mold, and carrying out hot pressing to obtain the low-dielectric-loss casting body. The low-dielectric-loss casting body has excellent mechanical properties and heat resistance, and satisfies the development and application of the low-dielectric-loss casting body.

The invention relates to high dielectric property copper-clad board glue and a preparation method thereof. The preparation method comprises adding methyl butynol into diglycidyl phthalate, stirring the mixture at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol and N, N-dicyclohexylcarbodiimide into the mixture, stirring the mixture for 5 minutes, then adding a modified silica system and nano-hollow alumina into the mixture, stirring the mixture for 15 minutes, finally, adding a modified epoxy system into the mixture, stirring the mixture at 125 DEG C for 2 hours, adding a butanone/PMA mixed solution into the mixture to obtain glue, dipping a 1080 glass cloth into the glue to obtain a prepreg, heating to dry the prepreg and preparing the modified epoxy resin-based copper clad board.The modified epoxy resin-based copper clad board has excellent dielectric properties and heat resistance and meets the development and application requirements of the modified epoxy resin-based copper-clad board.

The invention relates to a high-frequency electronic medium material. The material is manufactured in the mode that a reinforcing material is coated with glue and then hot-pressed. The glue preparation method includes the steps that triphenylsilyl chloride is dispersed in deionized water, then diethyl magnesium and 2-ethyl-1-hexanol titanium are added, then sorbitan monooleate ethoxylate is added, and filler is obtained; the filler is added into phthalic diglycidyl ester, and active filler is obtained; cyclopentadienyl iron tricarbonyl and a cyanate ester monomer are mixed, then an amino compound, aliphatic glycidol ether and diallyl phthalate are sequentially added, and resin prepolymer is obtained after cooling; then, the resin prepolymer is added into butanone and stirred; the active filler and acrylonitrile are added; PMA and diallyl diphenyl ether are added and continuously stirred to obtain a glue solution. The prepared high-frequency electronic medium material has excellent mechanical properties and heat resistance, and the requirements of development and application of the high-frequency electronic medium material are met.

The invention relates to a modified epoxy resin-based copper clad laminate and a preparation method thereof. The preparation method comprises: adding a modified silica foam system into a bifunctionalepoxy system, stirring for 30 min at a temperature of 120 DEG C, adding a monofunctional epoxy system and hollow nanometer alumina at a temperature of 95-105 DEG C, and stirring for 20 min to obtain aglue solution; and carrying out hot pressing molding on the glue solution, a reinforcing material and metal foil to obtain a modified epoxy resin-based copper clad laminate, wherein the obtained modified epoxy resin-based copper clad laminate has excellent flame retardancy and excellent heat resistance, such that the development and application of modified epoxy resin-based copper clad laminatescan be met.

The invention relates to a semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof. The method includes the following steps of: adding methyl butynol2-methylbutyraldehyde into diglycidyl phthalate, stirring at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol, N, N-dicyclohexylcarbodiimide and stirring for 5 minutes, then adding modified silicon dioxide system, nano hollow alumina and stirring for 15 minutes, finally adding modified epoxy system, stirring at 125 DEG C for 2 hours to obtain the glue solution; adjusting the solid content of the glue solution to be 65% by using butanone/PMA mixture, then dipping the reinforced material 1080 glass cloth into the glue solution to obtain the prepreg. The prepreg is heated and dried to obtain thesemi-curing sheet for the high dielectric property copper clad laminate. The modified epoxy resin-based copper clad laminate is prepared, has excellent dielectric property and heat resistance, and meets the development and application of the modified epoxy resin-based copper clad plate.

The invention relates to a preparation method of a heat-resistant composite magnetic material. The method comprises the following steps: mixing a phenolic compound with a bisphenol A cyanate ester monomer, and adding endo-methylene tetrahydro-biphenyl dimethylbenzene anhydride, pentaerythritol tetraacrylate and bisphenol A epoxy resin to obtain a resin prepolymer; mixing the resin prepolymer with methylene bis(dialkylthiocarbamate), a modified magnetic filler and a heterogeneous undecanol polyoxyethylene ether phosphate kalium salt to obtain a composite system; injecting the composite system into a mold coated with a release agent, and carrying out mold pressing in a vacuum condition; and finally turning off a power supply, naturally cooling the product and demolding the product to obtain the heat-resistant composite magnetic material. The heat-resistant composite magnetic material has excellent flame retardant property and heat resistance, and meets development and application of the heat-resistant composite magnetic material.

The invention relates to an electronic heat-resisting composite material. A nitrogen compound and ceramic powder are mixed for 2 h, and then N-formyl morpholine and sodium iodide are added and mixed for 1.5 h to obtain a mixture; an amine compound and a diisoamyl dicyclopentadiene oxide are added into the mixture in sequence to be stirred at the temperature of 95 DEG C for 2 h; then an acrylate-styrene copolymer is added to be stirred at the temperature of 120 DEG C for 1 h; then, 2,6-bi(4-aminophenoxy)benzonitrile is added to be stirred at the temperature of 180 DEG C for 2 min to obtain a compound; the compound is placed into a mold, and mold pressing is performed to obtain an electronic heat-resisting composite material. The preparation method is wide in raw material source, the preparation process is simple and controllable, only conventional operation is needed, and industrialization is facilitated.

The invention relates to a polypropylene-based polymer material, which is prepared through the steps of mixing nickel nitrate, magnesium nitrate and carclazyte evenly and then sintering in a muffle furnace at 1050 DEG C for 2h to obtain a solid; crushing the solid, and filtering through an 800-mesh sieve, wherein screen underflow is taken as a composite filler; melting and mixing polypropylene with the molecular weight of 13,000-16,000, phenoxyacetic acid, the composite filler, acrylic ester and benzoguanamine to prepare a polypropylene composition; and carrying out extrusion molding on the polypropylene composition through extrusion equipment and treating at 80 DEG C for 10min to prepare the polypropylene-based polymer material. The raw materials in the preparation method are readily available, the preparation process is simple and controllable, only normal operation is needed by post-treatment equipment and industrialization is easy to implement.