Filler used for flame-retardant heat-resistant copper-clad laminate and preparation method of filler
A copper clad laminate, heat-resistant technology, used in chemical instruments and methods, applications, household appliances, etc., can solve the problems of high water absorption, high dielectric constant, low moisture and heat resistance, low shrinkage, etc., to achieve good fluidity, Improved compatibility and narrow particle size distribution
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Synthetic example 1
[0031] Synthesis Example 1 Preparation of filler
[0032] Disperse 1Kg of nano-silica foam in deionized water, then add 200g of dodecylbenzenesulfonic acid, 200g of bismuth nitrate pentahydrate and 350g of methyltrichlorosilane; then hydrothermally react at 150°C for 2 hours; then filter the reaction Liquid, the filter cake was added to ethanol, dispersed evenly and then added 50g of polyoxyethylene sorbitan monooleate, stirred at 60°C for 2 hours, and finally dried to obtain filler (particle size: 560-880nm).
Embodiment 1
[0033] Embodiment 1 A method for preparing a flame-retardant and heat-resistant copper-clad laminate comprises the following steps:
[0034] Mix 5g DOPO and 100g bisphenol A cyanate monomer, stir at 95°C for 25 minutes, add 20g phenol compound, continue stirring for 30 minutes; then add 8g m-nitrobenzenesulfonic acid pyridinium salt, 58g Cyclopentyl ether, continue to stir for 20 minutes; add 9g dimethyl phosphite, stir at 100°C for 30 minutes; obtain resin prepolymer; add 32g filler to 12g diglycidyl phthalate, stir at 125°C 1 hour, obtain active filler; With 100g resin prepolymer and 9g indole compound (R 1 is hydrogen, R 2 is methyl, R 3 Amino) mixed, stirred at 120°C for 30 minutes; then added active filler, stirred at 130°C for 30 minutes; then added 1.5g of isomeric undecyl alcohol polyoxyethylene ether phosphate potassium salt, stirred at 140°C for 50 minutes to obtain a composite system; The above composite system is dissolved in a butanone / ethylene glycol methyl et...
Embodiment 2
[0035] Embodiment 2 A method for preparing a flame-retardant and heat-resistant copper-clad laminate comprises the following steps:
[0036] Mix 5g DOPO and 100g bisphenol A cyanate monomer, stir at 95°C for 25 minutes, add 30g phenolic compound, and continue stirring for 30 minutes; then add 8.2g m-nitrobenzenesulfonic acid pyridinium salt, 63g Pentyl cyclopentyl ether, continue stirring for 20 minutes; add 12g dimethyl phosphite, stir at 100°C for 30 minutes; obtain resin prepolymer; add 45g filler to 14g diglycidyl phthalate, 125°C Stir for 1 hour to obtain active filler; 100g resin prepolymer and 8.5g indole compound (R 1 is hydrogen, R 2 is methyl, R 3 For cyano group) mixed, stirred at 120°C for 30 minutes; then added active filler, stirred at 130°C for 30 minutes; then added 1.5g of isomeric undecyl alcohol polyoxyethylene ether phosphate potassium salt, stirred at 140°C for 50 minutes to obtain Composite system; the above composite system is dissolved in a butanone / ...
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