Filler used for flame-retardant heat-resistant copper-clad laminate and preparation method of filler

A copper clad laminate, heat-resistant technology, used in chemical instruments and methods, applications, household appliances, etc., can solve the problems of high water absorption, high dielectric constant, low moisture and heat resistance, low shrinkage, etc., to achieve good fluidity, Improved compatibility and narrow particle size distribution

Inactive Publication Date: 2018-05-01
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low moisture and heat resistance.
Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

Method used

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  • Filler used for flame-retardant heat-resistant copper-clad laminate and preparation method of filler
  • Filler used for flame-retardant heat-resistant copper-clad laminate and preparation method of filler
  • Filler used for flame-retardant heat-resistant copper-clad laminate and preparation method of filler

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0031] Synthesis Example 1 Preparation of filler

[0032] Disperse 1Kg of nano-silica foam in deionized water, then add 200g of dodecylbenzenesulfonic acid, 200g of bismuth nitrate pentahydrate and 350g of methyltrichlorosilane; then hydrothermally react at 150°C for 2 hours; then filter the reaction Liquid, the filter cake was added to ethanol, dispersed evenly and then added 50g of polyoxyethylene sorbitan monooleate, stirred at 60°C for 2 hours, and finally dried to obtain filler (particle size: 560-880nm).

Embodiment 1

[0033] Embodiment 1 A method for preparing a flame-retardant and heat-resistant copper-clad laminate comprises the following steps:

[0034] Mix 5g DOPO and 100g bisphenol A cyanate monomer, stir at 95°C for 25 minutes, add 20g phenol compound, continue stirring for 30 minutes; then add 8g m-nitrobenzenesulfonic acid pyridinium salt, 58g Cyclopentyl ether, continue to stir for 20 minutes; add 9g dimethyl phosphite, stir at 100°C for 30 minutes; obtain resin prepolymer; add 32g filler to 12g diglycidyl phthalate, stir at 125°C 1 hour, obtain active filler; With 100g resin prepolymer and 9g indole compound (R 1 is hydrogen, R 2 is methyl, R 3 Amino) mixed, stirred at 120°C for 30 minutes; then added active filler, stirred at 130°C for 30 minutes; then added 1.5g of isomeric undecyl alcohol polyoxyethylene ether phosphate potassium salt, stirred at 140°C for 50 minutes to obtain a composite system; The above composite system is dissolved in a butanone / ethylene glycol methyl et...

Embodiment 2

[0035] Embodiment 2 A method for preparing a flame-retardant and heat-resistant copper-clad laminate comprises the following steps:

[0036] Mix 5g DOPO and 100g bisphenol A cyanate monomer, stir at 95°C for 25 minutes, add 30g phenolic compound, and continue stirring for 30 minutes; then add 8.2g m-nitrobenzenesulfonic acid pyridinium salt, 63g Pentyl cyclopentyl ether, continue stirring for 20 minutes; add 12g dimethyl phosphite, stir at 100°C for 30 minutes; obtain resin prepolymer; add 45g filler to 14g diglycidyl phthalate, 125°C Stir for 1 hour to obtain active filler; 100g resin prepolymer and 8.5g indole compound (R 1 is hydrogen, R 2 is methyl, R 3 For cyano group) mixed, stirred at 120°C for 30 minutes; then added active filler, stirred at 130°C for 30 minutes; then added 1.5g of isomeric undecyl alcohol polyoxyethylene ether phosphate potassium salt, stirred at 140°C for 50 minutes to obtain Composite system; the above composite system is dissolved in a butanone / ...

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Abstract

The invention relates to a filler used for a flame-retardant heat-resistant copper-clad laminate and a preparation method of the filler. The method comprises the following steps: taking nano silicon dioxide foam, dodecylbenzene sulfonic acid, bismuth nitrate pentahydrate, methyl trichlorosilane, polyoxyethylene sorbitan monooleate as raw materials to obtain the filler. According to the filler provided by the invention, the filler is used for preparing the flame-retardant heat-resistant copper-clad laminate, and the filler has excellent flame-retardant performance and heat-resistant performance, and satisfies the development and application of the flame-retardant heat-resistant copper-clad laminate.

Description

[0001] This invention belongs to the patent application number 201510551973.9, the patent application date is September 2, 2015, and the patent name is a divisional application for the preparation method of flame-retardant and heat-resistant copper-clad laminates, which belongs to the technical solution of the product part. technical field [0002] The invention belongs to the technical field of electronic composite materials, and specifically relates to a filler for flame-retardant and heat-resistant copper-clad laminates and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0003] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/04C08K9/02C08K9/06C08K3/36B32B17/04B32B17/06B32B15/14B32B15/20B32B37/10B32B37/06
CPCB32B27/20B32B2250/03B32B2250/40B32B2260/02B32B2260/046B32B2264/102B32B2270/00B32B2307/3065B32B2457/08C08L2201/02C08L2201/08C08L79/04C08L71/02C08K13/06C08K9/08C08K5/0091C08L63/00
Inventor 彭代信宋晓静
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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