High dielectric property copper-clad board glue and preparation method thereof

Abstract

The invention relates to high dielectric property copper-clad board glue and a preparation method thereof. The preparation method comprises adding methyl butynol into diglycidyl phthalate, stirring the mixture at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol and N, N-dicyclohexylcarbodiimide into the mixture, stirring the mixture for 5 minutes, then adding a modified silica system and nano-hollow alumina into the mixture, stirring the mixture for 15 minutes, finally, adding a modified epoxy system into the mixture, stirring the mixture at 125 DEG C for 2 hours, adding a butanone / PMA mixed solution into the mixture to obtain glue, dipping a 1080 glass cloth into the glue to obtain a prepreg, heating to dry the prepreg and preparing the modified epoxy resin-based copper clad board.The modified epoxy resin-based copper clad board has excellent dielectric properties and heat resistance and meets the development and application requirements of the modified epoxy resin-based copper-clad board.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a glue solution for copper-clad laminates with high dielectric properties and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high specific strength, high specific stiffness, high temperature resistance, and ablation resistance. The copper clad laminate is obtained by hot pressi...

AI Technical Summary

Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low heat and humidity resistance.

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

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