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Low-dielectric-loss casting body

A castable, low-dielectric technology, applied in the field of new composite materials, can solve the problems of increased dielectric constant, decreased insulation resistance, and affecting circuit stability, and achieves uniform density, excellent heat resistance, and increased compatibility.

Inactive Publication Date: 2015-12-02
苏州凯欧曼新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the migration of oxygen vacancies in acceptor-doped inorganic materials, shortly after use, the insulation resistance of the material drops sharply, and the performance of the material deteriorates severely. There are many phase transitions at different temperatures, especially the phase transition near 120 ° C Electrical properties have the greatest impact. Existing materials will suddenly increase the dielectric constant at the above temperature, and cause a sudden change in capacitance, affecting the stability of the circuit.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The preparation of embodiment one filler

[0043] Disperse 1Kg of triphenylchlorosilane in deionized water, then add 600g of diethylmagnesium and 50g of ethyl titanate; then conduct a hydrothermal reaction at 120°C for 3 hours; then filter the reaction solution, dry the filter cake at 500 Calcined at ℃ for 3 hours, cooled naturally and then sintered at 850℃ for 1 hour to obtain the filler.

Embodiment 2

[0044] Example 2 Preparation of low dielectric loss cast body

[0045]According to the composition in Table 1, follow the steps below, mix the cyanate monomer and cyclopentadienyl tricarbonyl iron evenly, and react at 95°C for 0.8 hours; then add the amino compound, phenyltriethoxysilane in sequence Resin, stirred at 120°C for 2 hours, cooled to obtain a resin prepolymer; then the resin prepolymer was added to butanone, stirred for 1 hour; polyphenylene ether was added; stirred at 60°C for 0.5 hour, and filler and acrylate monomer were added , continue to stir for 0.5 hours, then add nano-polytetrafluoroethylene particles, and stir for 3 hours to obtain a glue solution; then pour the glue solution into a mold preheated at 120°C, and heat-cure to obtain a low dielectric loss cast body.

[0046] Table 1 Raw material composition (g)

[0047]

Embodiment 3

[0048] Embodiment three performance test

[0049] Adopt the unnotched impact form, test the impact strength according to GB / T2571-1995 (KJ m -2 ); the dielectric performance test uses the HP4276ALCR electric bridge, and the two sides of the sample are coated with conductive silver glue as electrodes before the test; the volume resistivity (×10 10 Ω·m) and electric strength (MV / m) are tested at 180°C.

[0050] The performance test results of the above-mentioned low dielectric loss castables are shown in Table 2.

[0051] Table 2 Performance of low dielectric loss cast body

[0052]

[0053] To sum up, the composition of the low dielectric loss casting body disclosed by the present invention is reasonable, and the compatibility between the various components is good, thus the low dielectric loss casting body is prepared, which has good mechanical properties, especially excellent insulation resistance, Meet the development and application of low dielectric loss casta...

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Abstract

The invention relates to a low-dielectric-loss casting body which is prepared by the following steps: preparing a resin-base composite system from a bismaleimide resin monomer, maleic anhydride, octamethylcyclotetrasiloxane, pentaerythritol tetraacrylate, a phenoxy oxygen resin, isomerized tridecyl alcohol polyethenoxy ether, a polycaprolactam resin, a filler and ethylene glycol; and adding the resin-base composite system into a mold, and carrying out hot pressing to obtain the low-dielectric-loss casting body. The low-dielectric-loss casting body has excellent mechanical properties and heat resistance, and satisfies the development and application of the low-dielectric-loss casting body.

Description

technical field [0001] The invention belongs to the technical field of new composite materials, and in particular relates to a cast body with low dielectric loss. Background technique [0002] Under the action of an electric field, the transformation from electrical energy to other forms of energy is collectively referred to as dielectric loss. It is the source of thermal breakdown of the dielectric. The energy consumed by the dielectric in a unit time is called the dielectric loss power, referred to as the dielectric loss. The development and research of new materials is the forerunner of the development of materials science. Composite material is a new type of material. It has been widely used in aviation, aerospace, energy, transportation, machinery, construction, etc. in the past 30 years due to its diverse functions and excellent performance such as voltage resistance, light weight, designability, high temperature resistance, and folding resistance. , chemical indust...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L79/04C08L27/18C08K3/00C08K5/12C08G73/06
Inventor 费根华
Owner 苏州凯欧曼新材料科技有限公司
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