Semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof

Abstract

The invention relates to a semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof. The method includes the following steps of: adding methyl butynol2-methylbutyraldehyde into diglycidyl phthalate, stirring at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol, N, N-dicyclohexylcarbodiimide and stirring for 5 minutes, then adding modified silicon dioxide system, nano hollow alumina and stirring for 15 minutes, finally adding modified epoxy system, stirring at 125 DEG C for 2 hours to obtain the glue solution; adjusting the solid content of the glue solution to be 65% by using butanone/PMA mixture, then dipping the reinforced material 1080 glass cloth into the glue solution to obtain the prepreg. The prepreg is heated and dried to obtain thesemi-curing sheet for the high dielectric property copper clad laminate. The modified epoxy resin-based copper clad laminate is prepared, has excellent dielectric property and heat resistance, and meets the development and application of the modified epoxy resin-based copper clad plate.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a prepreg for copper-clad laminates with high dielectric properties and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high specific strength, high specific stiffness, high temperature resistance, and ablation resistance. The copper clad laminate is obtained by hot pressing of ...

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Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low heat and humidity resistance.

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

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