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An electronic heat-resistant composite material

A composite material, electronic heat-resistant technology, applied in the field of electronic materials, can solve the problems of poor weather resistance and moisture and heat resistance, difficult to meet engineering technology, high cross-linking density, etc., to achieve improved compatibility, good curing effect, compatibility good effect

Active Publication Date: 2017-06-30
WUJIANG XINTA FORWARD HARDWARE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin contains a large number of epoxy groups. After curing, the crosslinking density is large, the texture is brittle, and the weather resistance and moisture resistance are poor. Therefore, it is difficult to meet the requirements of engineering technology, and its application is subject to certain restrictions.

Method used

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  • An electronic heat-resistant composite material
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  • An electronic heat-resistant composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0043] 1. Mix 350g of silicon dioxide, 20g of ytterbium fluoride, 160g of boron oxide, 190g of rutile titanium dioxide, 100g of zirconia, and 180g of shell powder, and then pass through a 500-mesh standard sieve to obtain a mixed powder; put the mixed powder at 650 Calcining at ℃ for 1 hour; then smelting the mixed powder at 1580℃ for 3 hours, quenching to obtain a glass block; finally, ball milling the glass block for 5 hours, and passing through a 800-mesh standard sieve to obtain ceramic powder;

[0044] 2. Mix 6g of nitrogen compound and 10.5g of ceramic powder for 2 hours, then add 1.3g of N-formylmorpholine and 1.8g of sodium iodide, and mix for 1.5 hours to obtain a mixture; sequentially mix 9g of amine compound, 28g of diisoprene Epoxide was added to the mixture and stirred at 95°C for 2 hours; then 11 g of acrylate-styrene copolymer was added and stirred at 120°C for 1 hour; then 6 g of 2,6-bis(4-aminophenoxy)benzonitrile was added , stirred at 180°C for 2 minutes to ...

Embodiment 2

[0046] 1. Mix 350g of silicon dioxide, 20g of ytterbium fluoride, 160g of boron oxide, 190g of rutile titanium dioxide, 100g of zirconia, and 180g of shell powder, and then pass through a 500-mesh standard sieve to obtain a mixed powder; put the mixed powder at 650 Calcining at ℃ for 1 hour; then smelting the mixed powder at 1580℃ for 3 hours, quenching to obtain a glass block; finally, ball milling the glass block for 5 hours, and passing through a 800-mesh standard sieve to obtain ceramic powder;

[0047] 2. Mix 80g of nitrogen compound and 100g of ceramic powder for 2 hours, then add 12g of N-formylmorpholine and 20g of sodium iodide, and mix for 1.5 hours to obtain a mixture; sequentially mix 95g of amine compound and 250g of diisoprene diepoxide Add to the mixture, stir at 95°C for 2 hours; then add 120g acrylate-styrene copolymer, stir at 120°C for 1 hour; then add 80g2,6-bis(4-aminophenoxy)benzonitrile, at 180 Stir at ℃ for 2 minutes to obtain the composite; then put th...

Embodiment 3

[0049] 1. Mix 350g of silicon dioxide, 20g of ytterbium fluoride, 160g of boron oxide, 190g of rutile titanium dioxide, 100g of zirconia, and 180g of shell powder, and then pass through a 500-mesh standard sieve to obtain a mixed powder; put the mixed powder at 650 Calcining at ℃ for 1 hour; then smelting the mixed powder at 1580℃ for 3 hours, quenching to obtain a glass block; finally, ball milling the glass block for 5 hours, and passing through a 800-mesh standard sieve to obtain ceramic powder;

[0050]2. Mix 7g of nitrogen compound and 10.5g of ceramic powder for 2 hours, then add 1.2g of N-formylmorpholine and 1.9g of sodium iodide, and mix for 1.5 hours to obtain a mixture; sequentially mix 9g of amine compound and 26.5g of diisoprene Diepoxide was added to the mixture and stirred at 95°C for 2 hours; then 11g of acrylate-styrene copolymer was added and stirred at 120°C for 1 hour; then 7g of 2,6-bis(4-aminophenoxy)benzyl was added Nitrile, stirred at 180°C for 2 minute...

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PUM

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Abstract

The invention relates to an electronic heat-resisting composite material. A nitrogen compound and ceramic powder are mixed for 2 h, and then N-formyl morpholine and sodium iodide are added and mixed for 1.5 h to obtain a mixture; an amine compound and a diisoamyl dicyclopentadiene oxide are added into the mixture in sequence to be stirred at the temperature of 95 DEG C for 2 h; then an acrylate-styrene copolymer is added to be stirred at the temperature of 120 DEG C for 1 h; then, 2,6-bi(4-aminophenoxy)benzonitrile is added to be stirred at the temperature of 180 DEG C for 2 min to obtain a compound; the compound is placed into a mold, and mold pressing is performed to obtain an electronic heat-resisting composite material. The preparation method is wide in raw material source, the preparation process is simple and controllable, only conventional operation is needed, and industrialization is facilitated.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to an electronic heat-resistant composite material. Background technique [0002] Epoxy resin has excellent adhesion, thermal stability and excellent chemical resistance. As a resin matrix for adhesives, coatings and composite materials, it is widely used in water conservancy, transportation, machinery, electronics, home appliances, automobiles and aerospace and other fields. According to the different curing methods of epoxy resin, epoxy resin coatings can be divided into normal temperature curing type, natural drying type, drying type and cationic electrophoretic epoxy coating. However, epoxy resin contains a large number of epoxy groups, and after curing, it has high crosslinking density, brittle quality, poor weather resistance and moisture resistance, so it is difficult to meet the requirements of engineering technology, and its application is limited....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L33/08C08K13/06C08K9/04C08K3/38C08K5/29C08K5/17C08K5/1535
Inventor 杨和荣
Owner WUJIANG XINTA FORWARD HARDWARE FACTORY
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