Camera module, electrical bracket and assembly method and application thereof

Abstract

The invention provides a camera module, an electrical bracket and an assembly method and an application thereof. The camera module comprises an optical lens, a photosensitive chip and the electrical bracket, wherein the optical lens is located above the photosensitive chip, and the photosensitive chip is electrically connected with the electrical bracket by implanting a metal ball, for example, a copper ball, so as to effectively save the cost and guarantee the electrical connection performance.

Description

technical field [0001] The present invention relates to the field of camera modules, and more specifically relates to camera modules, electrical brackets and their assembly methods and applications. Background technique [0002] With the rapid development of electronic products, their status in people's daily life is becoming more and more important. In order to realize the market demand of space saving and portability, electronic equipment is increasingly pursuing thinner and thinner, which requires the size of each component of electronic equipment, especially the thickness of each component to be smaller and smaller. For example, as one of the standard components of electronic equipment, The camera module also has a development trend of thinner and lighter. [0003] The structure of traditional COB (ChiponBoard) process camera module is assembled by soft and hard board, photosensitive chip, lens holder, motor drive and lens. Each electronic component is placed on the su...

AI Technical Summary

Problems solved by technology

However, no matter which method is used for the substrate of the camera module, there is a problem, that is, the substrate can only be connected to each other in the upper and lower directions.

That is, a photosensitive chip is pasted on the upper surface of the substrate, and devices are connected on the lower surface of the substrate, but it is not possible to make a buckle connection and a plug-in connection at the same time.

Therefore, the camera module structure in the prior art cannot meet the needs of connecting different devices

[0012] Furthermore, with the improvement of the pixels of the camera module in the prior art, the area of ​​the photosensitive chip inside the camera module will also increase accordingly, because components such as driving resistors and capacitors will increase accordingly, so the number of pixels of the camera module will increase accordingly. The package size will also become larger and larger

However, in the prior art, the equipment for encapsulating the camera module has higher and higher requirements for the size of the camera module. In the prior art, it is increasingly required that the packaged camera module be as thin as possible, and as small as possible. Therefore, There is a contradiction between the actual situation and the actual needs

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